3D InCites

Are you registered for our Integrating AI into the Semiconductor Advanced Packaging Environment webinar? On April 2nd, hear from Isabella Drolz from Comet Yxlon Chan Pin Chong from Kulicke & Soffa and John Bhenke from INFICON on all things artificial Intelligence in the semiconductor manufacturing space. AI is being utilized at all stages of production, with some of the most significant impacts being Digital Twin technology and defect-detection in advanced packaging. Register here: https://lnkd.in/gDsUZ2TX

Have you listened to the new 3D InCites podcast episode? Hear about how Arizona is revolutionizing semiconductor manufacturing through industry/academia/government partnerships involving the University of Arizona, Chandler Unified School District, and Arizona State University. These industry driven programs are allowing Arizona to create an ecosystem preparing students with real-world training, enhancing their performances during interviews and on the job. Scott Hayes, Liesl Folks, Janet Hartkopf, Christopher Bailey, Pallavi Praful, Rohit Gandhi https://lnkd.in/dmDfMziY

We are pleased to welcome Camtek to the 3DInCites community as our latest new member. Camtek develops and manufactures inspection and metrology equipment for the semiconductor industry, providing systems intended to inspect and measure wafers throughout the production process, from front-end to post-dicing stages. Camtek’s systems are designed to serve various semiconductor market segments, including advanced interconnect packaging, memory, CMOS image sensors, MEMS, and RF devices. Their clientele comprises global integrated device manufacturers (IDMs), outsourced semiconductor assembly and test companies (OSATs), and foundries. With manufacturing facilities in Israel and Germany, and offices in multiple regions, Camtek aims to provide solutions aligned with customer requirements all around the globe. Welcome to the community, Camtek. Keep on the lookout for what we have in store with them. Learn more about Camtek here https://lnkd.in/gK8pGsHM Talk to us about upgrading your membership! Learn more here https://lnkd.in/gEdJ_g8k

What’s happening in the world of global sustainability reporting requirements? The European Commission has recently proposed updates to the Corporate sustainability Reporting Directive (CSRD) and the Carbon Border Adjustment Mechanism (CBAM), which may raise concerns for manufacturers in the semiconductor industry. In her latest Sustainability 101 blog post, Julia Freer describes how these changes could affect one-third of 3D InCites member companies starting in July of 2028, as well as banks that rely on climate impact data to assess credit risk. Thinking long-term about sustainability should be prioritized, as it improves efficiency, resilience, and cost control, and ISO certifications should serve beyond just marketing. https://lnkd.in/gDfAaJea

The future belongs to those who can imagine something more. “Only those who can imagine where we want to go next will positively impact our global economy and society.” — Stefan Paul, CEO of Kuehne+Nagel. We believe the boldest strokes of progress come from #resilience and the courage to innovate. That’s why we created Where Next—a documentary series that explores how collaboration, bold thinking, and asking the right questions are building a better, more connected world. It’s a story that comes to life when we look at the development and impact of the tiniest, most important tech of modern life: #semiconductors. Stefan Paul invites you to join the conversation. Because the real power of #innovation isn’t just in the technology we build—it’s in the mindsets that shape the future we want to create. Watch the 3-episode series of Where Next here: https://lnkd.in/ezyhiedH

The US-JOINT consortium is a group of semiconductor suppliers looking to advance packaging and back-end processing technologies by driving research and development. Launched by Resonac, it comprises U.S. and Japanese innovation leaders, with 3M being its newest member. Also part of the consortium are 3D InCites member companies, NAMICS Corporation, Kulicke & Soffa, and KLA. They are creating cleanrooms and equipment installation, which is expected to be fully operational by 2025, further advancing technology as the U.S. is transitioninb to in-house semiconductor development. Philip Garrou also explores the state of Intel, highlighting how they have scrapped product launches and have had a significant loss in Q4. He reports that TSMC may take partial ownership of Intel's fabs, while there is another report of Broadcom possibly acquiring Intel's chip design business. https://lnkd.in/gdWjnRic

Congratulations to our elite member, EV Group, on the next-generation version of its GEMINI automated production wafer bonding system for 300-mm wafers. This newly designed high-force bond chamber is further innovating their process solutions and will help accelerate the large growth in the MEMS market expected in the upcoming years. The GEMINI wafer bonding system exemplifies EV Group's commitment to excellence for the MEMS industry. They are now accepting orders. https://lnkd.in/gmTx72Jy

Did you know that Ainos and ASE Global partnered to power AI scent digitization in semiconductor manufacturing? This partnership utilizes Ainos patented AI Nose technology to analyze airborne chemicals into “Smell IDs,” enhancing process efficiency and revolutionizing semiconductor manufacturing. These two companies will work together to integrate AI-powered VOC detection into ASE Global’s smart factories, further innovating the manufacturing process with a stronger ESG compliance, predictive maintenance, and smart factory operations. This collaboration will prove to be valuable, with Ainos expanding beyond healthcare with a pivotal technology like AI Nose. https://lnkd.in/gq_ZMQVq

AI was a hot topic at this year’s IMAPS Device Packaging Conference (DPC), as it is known to be driving innovation in the advanced packaging space. In her article, Jillian McNichol explains the most significant takeaways from the event, namely how AI is driving the demand for larger package sizes and larger high-bandwidth memory (HBM) stacks, with no single package structure particularly dominating the market. She also touches on chiplets and their potential as a solution for AI scaling issues, and, additionally, the evolving trajectory of generative AI. https://lnkd.in/gzY_WcQy

Have you listened to the new 3D InCites podcast episode, recorded live at International Microelectronics Assembly and Packaging Society (IMAPS) DPC 2025? Tune in to hear Fran?oise von Trapp speak with Hemanth Jagannathan, Mark Kuemerle, and Kimon Michaels say about the most pressing challenges and opportunities associated with artificial intelligence in semiconductor manufacturing and beyond. They also share examples of how AI is transforming industries like healthcare, and where AI should NOT be used. Even though the impacts of AI are still unclear, the panel remains optimistic. They raise an important question: Why must organizations either leverage AI or risk being outpaced by competitors? Listen to the full episode here: https://lnkd.in/gj9Ky8UG