3D InCites

Adoption of Generative AI is growing every day. Most of these solutions today are a combination of ASICs/GPUs and large stacks of HBMs, all packaged together. In fact, there could be as many as 8 to12 stacks of HBMs in an AI solution! Crazy, right? Have you ever wondered how to build advanced #HBM stacks for #AI chipsets? Then do we have the webinar for you! It happens December 11, at 9am, MST We've got Dean Freeman, who will will set the stage with a presentation on the current HBM market, and the predictions for the HBM Roadmap. Next up is Micron Technology's Bret Street, who will update us on HBM technology trends. Then Zia Karim of Yield Engineering Systems will bring it home, with a look at processes and technologies/tools in development to support next generation HBM. Register here! https://lnkd.in/gzrMFGKX

#November was full of exciting advancements and milestones for our community members. From cutting-edge technological breakthroughs and prestigious award recognitions to innovative partnerships, impactful collaborations, and significant company developments, our members continue to make remarkable strides in their fields. For example, Siemens EDA (Siemens Digital Industries Software) introduced Tessent In-System Test, a new design-for-test (DFT) solution that enhances in-system testing for next-gen integrated circuits (ICs). Cadence?achieved a major milestone with the successful tape out of its first Arm-based system chiplet, a groundbreaking innovation in chiplet technology. Deca Technologies?was selected, along with Arizona State University to lead the $100 million SHIELD USA project, a groundbreaking initiative under the CHIPS Act’s National Advanced Packaging Manufacturing Program. Amkor Technology, Inc. partnered with Lightmatter to create the largest-ever 3D-packaged chip complex using Lightmatter’s Passage platform. ASE Global?received TSMC’s Open Innovation Platform’s Partner of the Year Award 2024?as a 3DFabric OSAT. Nordson Electronics Solutions, Nordson Test & Inspection and Indium all received 2024 Global Technology Awards. Six of our member companies had employees who were SEMI Europe's 20 under 30 honorees - including Semilab Zrt, Cadence, DR YIELD, IBM, Edwards Vacuum and KLA. Read on for these and more member mentions for ACM RESEARCH, INC., Yield Engineering Systems, SEMI, and StratEdge Corporation in the wrap-up our intern Avery Gerber. https://lnkd.in/gqGtK3jj

Now that SEMICON Europa is done and dusted, it's time to move on to the next SEMI event that our members are gearing up for: #SEMICONJapan2024! In her latest blog, Jillian Carapella captures the excitement for this event, and provides a guide, complete with booth party schedule, for where you can find our members speaking, exhibiting and networking. They include: TechSearch International, ASE Global, Cadence, IBM, Lam Research, Onto Innovation, and Siemens EDA (Siemens Digital Industries Software) Find and bookmark the blog post here: https://lnkd.in/g6MkNcQh

?? NEW PODCAST EPISODE?? This episode was recorded live at SEMI Europe's #SEMICONEuropa in Munich. Fran?oise von Trapp talks with speakers about how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It's going to be tricky, for sure. Frederic Godemel of Schneider Electric explains how electricity generated from renewable sources will help address these issues and implores the industry to focus on growing responsibly so it can meet its goals. Comet CEO, Stephan Eirik Haferl, discusses the importance of developing power-efficient semiconductors. He talks about the power advantages of 3D stacking and heterogeneous integration and explains how 3D X-ray technologies helps bring these technologies to market. Bart Plackle of imec, who talked about next generation vehicle architectures enabled by sensing and #chiplets. You’ll learn what’s driving the need for chiplets in today’s software-defined vehicles, and how chiplet architectures can take us to the next level of autonomous vehicles. Listen to the full episode here: https://lnkd.in/gyhswX-7

Have we been back from #SEMICONEuropa 2024 for a week already? Here are all the people we connected with. It began with the 2024 3D InCites Stammtisch and Interconnectology Eisstockschiessen Invitational, and continued through to the trade show itself, as we attended talks, product launches, podcasts and parties. How many people do you recognize? Tag your friends in the comments below! Thanks again to our host sponsor, LQDX, Keg Sponsor LPKF Laser & Electronics SE, and Table Sponsors - Kiterocket, Semilab Zrt, ACM RESEARCH, INC., Evatec AG, and Invest in Bavaria - The Business Promotion Agency of the State of Bavaria! https://lnkd.in/ghY-JiZW

This week, we’re shining the spotlight on ERS electronic GmbH. The company is renowned for its innovative thermal chucks and cutting-edge solutions in the advanced packaging and advanced back-end semiconductor markets. In 2008, ERS brought its thermal management expertise to the forefront of #advancedpackaging, developing solutions for debonding fan-out eWLB reconstituted wafers. Fast forward to today, ERS’s automated and manual debonding and warpage adjust systems are a staple on production floors of top semiconductor manufacturers and #OSATs worldwide. Beyond wafers, ERS has spent over six years working on equipment for panels, with support for sizes up to 650 x 650 mm. This year, the company launched the Luminex product line, featuring semi-automated and automated debonding machines for wafers and panels. In collaboration with fellow 3D InCites member, PulseForge, Inc., Luminex integrates the “PhotoThermal” debonding process, offering stress-free debonding and over 30% operational savings compared to traditional laser debonding methods. ERS is also expanding its global footprint, with a new production and demo center in Barbing, Germany, and facilities for machine testing and evaluation in the US and China.

Congratulations to three of our community members who are part of the SHIELD USA Project - Deca Technologies, IBM and Saras Micro Devices! This is big news for Arizona and Arizona State University's Macro Technology Works. Read all about it here: https://lnkd.in/gftKyCVy ?? Note that In this program "SHEILD" stands for ?Substrate-based Heterogeneous Integration Enabling Leadership Demonstration. Not to be confused with the Shield USA intiative run by ICE. (Google doesn't seem to know the difference between an acronym and a word)

As options unravel for using nuclear power as a source of energy for AI data centers, it appears Google, Meta, Amazon Web Services (AWS), and Microsoft, are all backing off their net zero goals due to the power demands of #AI. This is a sobering thought, as early energy reports from COP29 Azerbaijan claim the world is going to miss emission targets, and temperature levels will rise to unbearable levels. In his latest #sustainability blog post, provides some insight on the situation. Read it here: https://lnkd.in/gZVYcVcq

If you've been waiting to find out what Amkor Technology, Inc.'s Arizona facility will focus on, you're wait is over. In his latest blog post, Philip Garrou gets the scoop from David McCann. He also has some news to share about #CHIPSAct funding for Wolfspeed and Hemlock Semiconductor. Read it all here: https://lnkd.in/g2nuc3eA

When you come home from a trade show like #SEMICONEuropa2024, what do you remember most? Is it the presentations? The latest technologies? If you're like us, it's neither of those. It's the connections you've made and the conversations you've had that stands out. So in this year's recap blog post, Fran?oise von Trapp talks about the new people she met and what she learned from them: People like Julius H?llstedt, Sebastiaan Muller, Paolo Fioravanti, Augustin Detruit, Charis Kalantzi, James McGrath, Luca Sinkó, Dr. Jessica Stubbe - and the newest newcomer to the industry (we hope!) Caroline Bucknam! Read the full story here: https://lnkd.in/gi9qQs5X