International Microelectronics Assembly and Packaging Society (IMAPS)

GivingTuesday December 3 ~ ?IMAPS has chosen to join the GivingTuesday movement to focus on raising additional important funds to help expand our 2025 efforts ~ to offer more students in the microelectronics industry financial assistance and awards through our Microelectronics Foundation’s mission and efforts. Student involvement in IMAPS is critical to workforce development and the future of the microelectronics and packaging industry! GivingTuesday?is a global generosity movement unleashing the power of radical generosity. It was created in 2012 as?a day that encourages people to give back in whatever ways they can. To learn more and join the cause, please visit: https://lnkd.in/gp4x63jg (Donations are tax deductible)

We attended a great technical meeting for the IMAPS Cleveland-Pittsburgh Chapter on Tuesday organized by Matthew Apanius. Thank you Momentive Technologies for hosting the meeting and providing a tour of your facilities. Excellent technical presentations by Anand Murugaiah, Donald Davis, Martin Panchula, Jim Ohneck, and Johnny Vanderford. We look forward to seeing you all at the next chapter meeting in Pittsburgh.

The IMAPS Symposium 2024 had an amazing technical program, and we are pleased to recognize the Best of Symposium (the highest accolade of the track winners), Best of Track, and Best of Session.?We also applaud the 3 Student Award winners for Best Student Poster, Paper and Presentation. These awards provide industry-wide, global recognition and some winners receive financial awards. Student winners receive monetary prizes funded by the IMAPS Microelectronics Foundation. Each annual IMAPS Symposium incorporates this awards program, so keep that in mind for 2025! ? For the full list, visit the?Symposium Winners?page: https://lnkd.in/gT-89VKA Best of Symposium, Track and Session winners: Yutaka Suzuki | Alexander Kanitz | Gilbert Moreno | Takamasa Takano | Pingping Ye | Marius Adler | Junyong Park | Gaurav Sharma | Urs Berger | Emily Lamport | Amy Lujan | Ning Liu | Ivan Ndip | Tim Jensen | Akihiro Shimizu | Huang Wen Hung | Greg Prokopowicz Student winners: Waleed Al-Shaibani | EMUOBOSAN enakerakpo | Ashraf Umar |Riadh Al-Haidari | Abdullah Obeidat | Mohammed Alhendi | Mark D. Poliks | Drew Weninger | Samuel Felipe Serna Otalvaro | Luigi Ranno | Lionel Kimerling | Anuradha Agarwal | G. Cagatay Ozseker | Ahmed Busnaina #IMAPS2024

Join the IMAPS Arizona Chapter for a Technical Presentation and Networking on December 11. Presentation: ?"Datacenter Power Delivery in the Changing AI Landscape" Speaker: Mike Ranjram, ASU Assistant Professor Hosted?by Saras Micro Devices (3200 W Germann Rd, Chandler, AZ) Check-in:?4:15 - 4:30 Welcome and Presentation 4:30 - 5:30 Networking Happy Hour 5:30 - 6:30 Visit the Arizona Chapter page to register: https://lnkd.in/dv-JP2Z2

Fan-out wafer level packaging (FOWLP) technologies have come a long way over the past 15 years. Today, the entire electronic packaging industry sits at a crossroads, where FOWLP has the potential to?eliminate technologies like wirebond and bump interconnections, substrates, leadframes, and more.? ? Interested in learning more about FOWLP? In two courses available now from?IMAPS?Academy, advanced packaging expert Beth Keser, Ph.D. walks us through an introduction to FOWLP and the advances the technology has seen.? ? IMAPS?Academy is your online portal for microelectronics packaging professional development. Learn more and register today:?www.imapsacademy.org ? #Semiconductor #AdvancedPackaging #IMAPS ?

Join the Cleveland/Pittsburgh Chapter on November 19 for a chapter meeting with five speakers and a tour of the Momentive Technologies facility. 22557 West Lunn Road, Strongsville, OH 44149 ? Agenda:? 10:00AM - Welcome – Matt Apanius, Microfabrication Solutions, Inc.? 10:30AM - Dr. Anand Murugaiah, Momentive, “Chasing the Cold in Power Electronics with Boron Nitride Filled Potting Compounds”? 11:00AM – Donald Davis, Kent Displays, “Interconnects for Flexible Electronics” 11:30 AM - Lunch - Dr. Martin Panchula Panchula (CTO), Momentive, “Solving Wide Bandgap (WBG) Semiconductor Process and Device Challenges with Advanced Ceramics Materials” 12:30PM - Jim Ohneck, Microdul, "Miniaturization in Medical Implants by an EMS" 1:30PM - Johnny Vanderford, Lorain County Community College, "Collegiate Education Coursework in Microelectronic Packaging for New Technicians: Methodology and Challenges" 2:00PM - Momentive Strongsville Facility Tour Tickets:?Just $20 for Members, $25 for Non-Members, $10 for Students Register at: https://lnkd.in/gth-VWRq

Power/CICMT/HiTEC Conferences ~ CALL FOR ABSTRACTS due December 1. Our Power Packaging, Ceramic Interconnect & Ceramic Microsystems Technologies, and High Temperature events come together for a great opportunity for you.....one location, one registration, and three times the content, networking, and learning! The 2025 conference will feature combined plenary and keynote presentations, along with specific technical afternoon sessions. Tap into these 3 great events! Registration and Hotel Room Block now open. https://lnkd.in/gwacunnM #AlbuquerqueSemiconductor #microelectronics #PowerPackaging #CeramicInterconnect #HighTemperatureElectronics

CALL FOR ABSTRACTS: The deadline is approaching for the IMAPS Advanced Technical Workshop and Tabletop Exhibition on?Wire?Bonding?~ February 3-5, 2025 in San Diego, California. This workshop has been organized to allow for the presentation and debate of some of the latest technologies out there related to the use of?Wire?Bonding in battery pack, semiconductor and microelectronic packaging. Those wishing to present a 25-minute technical talk (+5 mins Q&A) at the workshop, please submit a ~250 word abstract electronically no later than?November 15, 2024.?Full papers are not required. If you're in the wire bonding space, hope you can join us as a presenter or attendee! Visit the event page at: https://lnkd.in/gEc-YZ_T #wirebonding

The Professional Development Courses for Device Packaging Conference 2025 (Phoenix, Arizona) are now online and open for registration. These supplemental, 2-hour classroom-style tutorials are taught by the best in the industry.?With a narrow educational focus, the topics offered at DPC 2025 are designed to help attendees broaden their scope of knowledge in advanced packaging. The 16 available courses are offered on Monday, March 3, prior to the Conference beginning on March 4. Take a look at the abstracts and instructors at: https://lnkd.in/gbFzZDv3 DPC 2025 will be held at a beautiful, new location: Sheraton Wild Horse Pass in Phoenix. The exhibit hall just sold out and the program will be posted soon! #DPC2025

Get involved in an upcoming local IMAPS Chapter event this month. It's a great way to meet industry colleagues in your area and enjoy technical presentations. November 7, 2024 (5:30 - 9:00) New England Chapter Multi-Society Joint Dinner Meeting "RF (Far Field) Wireless Power" Speaker: Sanjay Gupta, AirFuel Alliance The Establishment Restaurant, North Chelmsford, MA https://lnkd.in/gSBB7gDB November 8 (12:45 - 2:00) San Diego Chapter Lunch "The NIST Office of Advanced Manufacturing Supported Roadmap Effort" Speaker: Urmi Ray Hosted at San Diego State University https://lnkd.in/gSyWUjM8 November 19 (10:00 - 3:00) Cleveland/Pittsburgh Chapter Meeting and Tour 5 Speakers Martin Panchula | Anand Murugaiah | Donald Davis | Jim Ohneck | Johnny Vanderford and Momentive Facility Tour Hosted at Momentive Technologies, Strongsville, OH https://lnkd.in/gth-VWRq