Empower Semiconductor

OCP Global Summit is in full swing! Our team is excited to be part of the discussions shaping the future of open computing. From insightful sessions to networking with industry leaders, it’s an incredible opportunity to engage and innovate. If you're at the summit, come visit our booth #C61 to see our new Crescendo product and explore how we’re driving advancements in vertical power! #OCPGlobalSummit #VerticalPower

Next week, our CTO, Trey Roessig, will dive into the future of power delivery at the OCP Global Summit! Learn how vertical power delivery can revolutionize AI xPU processors by enabling higher power density, performance and efficiency. Traditional lateral power schemes can’t keep up with today’s power demands, limiting compute power and throughput. Trey will discuss how moving DC/DC converters beneath core chips supports voltage more effectively, enhances power density, and reduces heat, all while enough space for a cooling plate. Catch the session on Thursday, October 17, from 9:45am to 10:05am at the SJCC Concourse Level, 210CG. Register today: https://bit.ly/4d8GJVE #FromIdeasToImpact #OCPGlobalSummit #VerticalPowerDelivery

Introducing our new, revolutionary AI power delivery platform—Crescendo! Crescendo is a scalable on-demand kW vertical power delivery platform transforming power delivery for AI and high-performance computing, breaking through critical tech barriers. With our cutting-edge FinFast? technology, Crescendo delivers unmatched power density, speed and efficiency. “AI’s accelerating power requirements far outpaces the capability of today’s lateral power solutions, both in scale and speed. In developing the Crescendo platform, Empower enables generations of new AI processors to hit their performance goals while running efficiently and cool” – Tim Phillips, Founder & CEO Read the full announcement for more details: https://bit.ly/3zQaY64 #Empower #Crescendo #FinFast #VerticalPower

How do you achieve the right balance between power efficiency, performance and cost in chip designs? Industry leaders dove deep into power-related challenges and solutions like voltage droop, advanced packaging and vertical power delivery during a roundtable discussion. Check out the latest segment of this insightful conversation on Semiconductor Engineering to see how these critical issues are being tackled. ? Read here: https://bit.ly/47swzy8 Curious to learn more? Explore the first two parts of this roundtable discussion: Part 1: https://bit.ly/3zV3yhA Part 2: https://bit.ly/4dzWENY #Semiconductors #PowerEfficiency #VerticalPower

We will unveil our new innovative power platform at OCP Global Summit in San Jose, California, from October 15-17. Visit us at Booth #C61 and the Innovation Village Station to experience how you can combine leading speed, power density and efficiency for AI and HPC core power domains. Don’t miss out—register today and learn more here: https://bit.ly/4d8GJVE #OCPSummit24 #FromIdeasToImpact

We are proud to announce that Empower has been named an honoree in the EDGE Awards for our latest silicon capacitor product, EC1005P! Recognized in the Electronic Components and Enclosures category, this recognition highlights our commitment to constantly improve power integrity and reliability as advancing AI technology pushes the boundaries of traditional decoupling. The EC1005P stands out for its large bandwidth decoupling of power delivery networks and compact form enabling in substrate embedding. At Empower, we remain dedicated to pushing the boundaries of innovation and shaping the future of our industry. This is just the beginning, and we’re excited for what’s on the horizon! #EDGEAwards

Data centers worldwide will consume an estimated 4% to 9% of overall power by the end of the decade, driving the need for energy-efficient chip designs. Industry experts, including our CTO and SVP of Engineering, Trey Roessig, shared insights during a panel at DAC. They emphasized the importance of system-level efficiencies and stressed the vital role that advanced packaging and chiplets play in achieving energy savings. Catch the highlights in this Semiconductor Engineering article: https://bit.ly/4dzWENY #Semiconductor #ChipDesign #PowerManagement

We are thrilled to announce that Empower has been selected as a finalist for The Electronics Industry Awards! ?? We’re honored to be recognized in two key categories: Semiconductors Product of the Year and Medical Product of the Year. This recognition underscores our commitment to power density, performance, and simplicity, as well as our unique innovations that eliminate ferromagnetic materials, allowing their use in high-performance medical imaging applications. Stay tuned as we eagerly await the final results! ?? #Innovation #Semiconductors #MedicalTech

Dive into the progression of smartphone computing technology with this article by Zaixing Fu and Mukund Krishna! Discover how silicon capacitors, such as ECAPs, are transforming the performance of smartphone SoCs and application processors (APs). Learn how utilizing these flexible, ultra-low impedance products addresses the last inch of power delivery in this Electronic Design article. Read now: https://bit.ly/3WGp9lP #SmartphoneTech #Innovation #ECAPs

If you want to be involved in groundbreaking technology and have a chance to innovate, Empower is the place for you! We're searching for a skilled Sr. Staff Packaging Engineer to join our R&D team in San Jose, CA. As a global leader in integrated voltage regulator (IVR) and ECAP silicon capacitor technologies, we’re looking to add to our innovative team that's transforming power solutions and pushing the limits of physics. ? Ready to join our team? Apply below! ? #Hiring #Engineer #Recruiting