Special thanks to Steve Fu and the Celesta Capital team for arranging this unforgettable experience at Chase Center!?????Team Eliyan had an amazing time cheering on the Golden State Warriors from the Celesta suite.?????? #CelestaVC #TeamEliyan Syrus Ziai
Eliyan Corporation
半导体制造业
Accelerating a Smarter Future by Revolutionizing Chiplet-based Systems
关于我们
Eliyan's mission is to revolutionize chiplet connectivity technologies by challenging the status quo to unleash the ultimate performance of smart systems of the future.
- 所属行业
- 半导体制造业
- 规模
- 11-50 人
- 总部
- Santa Clara
- 类型
- 私人持股
- 创立
- 2021
地点
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主要
US,Santa Clara
Eliyan Corporation员工
动态
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?? Exciting News! ?? We're thrilled to announce that Eliyan Corporation has been nominated for an award at the prestigious GSA event!
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Another major milestone for our breakthrough multi-die interconnect solution. We have taped out our #NuLink #PHY on Samsung Foundry SF4X process node, achieving up to 40 Gbps bandwidth at unprecedented power levels with #UCIe-compliant #chiplet #interconnect technology. #HBM #memorywall Read more here. https://lnkd.in/ekruM9ri
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Thanks to Kenneth Briodagh at Embedded Computing Design for having us on The Embedded Insiders podcast. Talking #interconnect, #chiplets, #HBM and all things #AI. Patrick Soheili Kevin Donnelly Richard Nass https://lnkd.in/esGKTEwP
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?? Thank you to all who attended our Semiconductors & AI Innovation Forum! On October 28 in the vibrant heart of San Francisco, a high-energy event united 24 groundbreaking startups from around the world with over 120 industry leaders and investors, all ready to redefine the future of #semiconductors and #AI. Thanks to everyone who attended and helped make this event unforgettable (we apologize that we couldn't accommodate 500+ of you who requested attendance). ?? and a huge shoutout to our sponsors, Arm, and FOXCONN HON HAI TECHNOLOGY, Foley & Lardner LLP?and?CBRE for your awesome support! ?? We also announced the finalists for the Extreme Tech Challenge Semiconductors & AI Innovation Startup Cup. ?? Congratulations to our Top 8 Finalists who now advance to pitch at #CES 2025 on January 7 in Eureka Park at Venetian Expo: Ambient Scientific, Applied Brain Research, ATLANT 3D , Jmem Tek, Literal Labs, Phanofi, Terecircuits Corporation, UncovAI ?? ?? ?? Watch the video recording of all the discussions at the forum https://lnkd.in/ejNmT_f2 ? Remarks by Young Sohn (Walden Catalyst Ventures, Extreme Tech Challenge, Arm, Cadence Design Systems), Bill Tai (Extreme Tech Challenge ACTAI Global), Will Abbey (Arm) ? Fireside Chat with Young Sohn on Balancing Sustainability with the Energy Needs for AI, interviewed by David (Dede) Goldschmidt (Samsung Catalyst Fund) ? Panel 1: AI Chips and Infrastructure [hosted by Jonathan Charles (Samsung Catalyst Fund) with Fabrizio Del Maffeo (Axelera AI), Davor Capalija (Tenstorrent), Santosh Raghavan (Groq)] ? Panel 2: Interconnect and Packaging Technologies for Sustainable AI [hosted by Francis Ho (Walden Catalyst Ventures) with Alan Liu (Quintessent Inc.) and Syrus Ziai (Eliyan Corporation) ? Semi and AI Startup Cup - Finalists announcement See you at CES in January!
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The always insightful writer Timothy Prickett Morgan digs deep into #HBM challenges in his latest report for The Next Platform. Memory wall issues have engineers looking for creative solutions, but there is sense of urgency. One approach he recommends: "Because of the memory-compute imbalance, customers are spending a fortune on a device that cannot come close to its peak performance because of bandwidth and capacity bottlenecks in the HBM memory. We either need HBM4E memory early, or as?we wrote about back in March this year?when covering the simultaneous bi-directional NuLink PHYs from Eliyan, we need a way to hook a lot more HBM3E memory to the current devices." https://lnkd.in/epdF8CwM
We Can’t Get Enough HBM, Or Stack It Up High Enough
https://www.nextplatform.com
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Check out the insightful talk by our Ramin Farjadrad at the recent #OCPSummit24. He presents a solution to the growing memory & IO wall challenges faced by high performance computing. Changes in #basedie, leveraging #chiplets, and innovations in #interconnect are required for increased bandwidth for die-to-die and #HBM connectivity in multi-die designs. #UMI #SiP #NuLink Timothy Prickett Morgan https://lnkd.in/eT9q6avt
Innovative Architectures to Break Memory & IO Walls for Gen AI ASICs & Systems
https://www.youtube.com/
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#OCPSummit24 has posted all of the presentations online! The talks from Eliyan Corporation and many others at the OCP link below https://lnkd.in/ggTKH5Zy Under the Server: Chiplets section you can find my talk on new additions to the BoW 2.1 PHY spec to facilitate D2D interfaces to memory chipsets.
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Thanks for sharing our news!
Eliyan Corporation, founded in 2021, focuses on chiplet-based semiconductor solutions to enhance design efficiency. Their NuLink?-2.0 PHY, utilizing a 3nm process, achieves high performance with significant bandwidth improvements. Recent funding from Venturetech Alliance LLC exceeds $100 million, positioning Eliyan for growth in advanced interconnect technologies within the expanding semiconductor market. Meet the team ?? Ramin Farjadrad | Patrick Soheili | Syrus Ziai | Alan Krock | Kevin Donnelly | KH Lee | Paul Hylander | Sean Lundy | Anup Jose | Ali Khoshniat | Sean Lundy | Farhad Tabrizi | Reza Pazhouhandeh
A Breakthrough with Eliyan’s NuLink?-2.0 PHY Utilizing 3nm Technology
https://semiconductorsinsight.com
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Thank you to TECHBLITZ in Japan for featuring Eliyan in a recent issue of your publication that is read by tech leaders and investors through that region. Patrick Soheili Hidenobu Mori https://lnkd.in/gx7fwZNn
AI向け性能は最大10倍?チップレット相互接続の独自技術を開発 Eliyan
https://techblitz.com