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"High-Bandwidth #Chiplet #Interconnects for #AdvancedPackaging Technologies in #AI/#ML Applications: Challenges and Solutions" by Shenggao Li; Mu-Shan Lin; Chih-Wei Chen; Chun-Chien Tsai (TSMC) https://lnkd.in/exncnxhw The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by Artificial Intelligence and Machine Learning (AI/ML). This paper reviews these advanced packaging technologies and emphasizes critical design considerations for high-bandwidth chiplet interconnects, which are vital for efficient integration. #3DIC #semiconductor

"Exploring #CXL Memory Disaggregation: Use Cases and System Benefits" by Jungmin Choi, Memory System Architect, SK hynix and Myoungseo (Matthew) Kim, Ph.D. , Director, Systems and Computer Architect, SK hynix https://lnkd.in/epJcNHGr In this session, we dive into powerful use cases for DCD (Dynamic Capacity Device) based memory pooling and sharing specified in CXL 3.1 that can reduce costs from a datacenter operations perspective. Each host connected to the memory pool can manage resources flexibly through dynamic memory allocation. We also address use cases for system benefits, such as optimal memory tiering and data placement that each host can achieve through telemetry including hotness tracking provided by the device. Regarding memory sharing, we analyze the characteristics of HPC/AI workloads and explore performance improvement through control and data path optimization between hosts. Specifically, we focus on distributed computing frameworks such as Spark and Ray, which suffer from heavy network traffic and memory duplication due to data object sharing. Through HW/SW system implementation and concrete performance studies, we provide insight into CXL memory pooling and sharing within a multi-host environment. #chiplet #semiconductor

"#Photonic Fabric for #AI #interconnect" By?Uday Poosarla - Celestial AI https://lnkd.in/euaKWzim The Photonic Fabric provides the foundational technology for optically scalable, disaggregated #datacenter compute and memory to unleash advancements in AI with sustainable and profitable business models. Celestial AI’s Photonic Fabric delivers a transformative leap in AI system performance and energy efficiency.

"Is a #GPU, #ASIC or #chiplet-based SoC better for #AI as we switch from training to inference?" by Alphawave Semi https://lnkd.in/eMGV9Uyu The demand for AI applications continues to rise and this connectivity issue comes at the same time as the costs of general-purpose GPUs for specific workloads and their high power consumption are motivating a move away from GPU-centric compute architectures, towards custom silicon and chiplet-based designs. #semiconductor

Siemens EDA (Siemens Digital Industries Software) intros next-gen ESD; focus on chiplet-design kits (CDK) By Pradeep Chakraborty https://lnkd.in/e33eiZxt "Innovator 3DIC delivers a fast, predictable path cockpit for the planning and heterogeneous integration of ASICs and #chiplets using the latest and most advanced #semiconductor #packaging 2.5D and 3D technologies, and substrates in the world" said Ruchir Dixit #chiplet #semiEDA #3DIC

Top-Down Vs. Bottom-Up #Chiplet Design https://lnkd.in/edv4kskX There is an underlying tug-of-war underway between large, vertically integrated players that want to tightly define the socket specifications for chiplets, and a broad swath of startups, systems companies, and government agencies pushing a top-down approach that allows chiplet developers to explore new and different options based on standardized interconnects. #3DIC #semiconductor

Alphawave Semi Drives Innovation in Hyperscale #AI Accelerators with Advanced I/O #Chiplet for Rebellions https://lnkd.in/eKkCfmjf #semiconductor “Alphawave Semi offers the highest-performance connectivity IPs in the industry, but what truly influenced our decision was their leadership in customizable chiplet-based designs,” said Jinwook Oh, the CTO of Rebellions.

"#Optical Transmission Modulation Methods Advance" https://lnkd.in/erkw729G EE Times Europe spoke with Tony Chan Carusone, chief technology officer of Alphawave Semi, to discover the underlying applications driving bandwidth demand and to find out if #PAM4 and coherent modulation techniques are ever likely to converge. #chiplet #photonic

New Tradeoffs In Leading-Edge Chip Design https://lnkd.in/eVJbxCe6 Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, memory, sensors — are available? #3DIC #chiplet #semiconductor

#GSCM2024: Interview with A. M. Fitzgerald & Associates, LLC' Alissa M. Fitzgerald, Ph.D. https://lnkd.in/eZtMmEW5 In this interview, Nitin Dahad sat down with Alissa Fitzgerald to talk about through-silicon vias, #chiplets, #3DIC, and how these "new" technologies originated from #MEMS technologies developed decades ago. #semiconductor