Blue Cheetah Analog Design, Inc.

Chiplets Make Progress Using Interconnects As Glue.. Check out the article below. #chiplets #interconnects

Live on LinkedIn November 7... "The Rise of The Hublet? & FPGA Chiplets." Blue Cheetah Analog Design, Inc.'s Elad Alon joins Primemas and Achronix Semiconductor Corporation in a discussion about this technology and how it is transforming how we build accelerators and memory solutions. #Chiplet #CXL #FGPA Sign up for the event here: https://lnkd.in/e7B6bPZG

Catch the Chiplet-Marketplace.com?interview of Blue Cheetah's Marc Greenberg on the floor of OCP Summit last week. Watch as he talks about Blue Cheetah's BlueLynx cutting-edge technology that facilitates high-speed communication between multiple chiplets, or small integrated circuits, within a single package.? https://lnkd.in/eNhhYDXZ

Don't miss this special report from Semiconductor Engineering on Partitioning in the Chiplet Era. #chiplets #bluecheetah

Blue Cheetah's Elad Alon explains why?the path forward for a chiplet market lies in the multi-vendor ecosystems approach. The partners in these ecosystems will define the individual chiplet sockets that meet the sweet spots for their target product, product family, or overall product roadmap. Read Elad's blog article in Semiconductor Engineering https://lnkd.in/gFmyK3DV

AI chip startups are boldly challenging ecosystem heavyweights to disrupt architectures. Blue Cheetah is proud to be the leading provider of die-to-die Chiplet interconnect solutions that address the incredible and fast-growing demand for AI compute.? Read about it here on this Synopsys blog: https://lnkd.in/emS63b-3

Blue Cheetah Analog Design and LG Electronics Inc. (LG) announced today that they are collaborating and have demonstrated silicon success for a new generation of chiplets that can potentially be used in LG's future AI-enabled products.? See the full article here: https://lnkd.in/guEDSCXH

A fascinating discussion on Defining The Chiplet Socket featuring?Blue Cheetah,?Elad Alon, and colleagues from Marvell, Samsung, Baya Systems, and Synopsys. See the article here: https://lnkd.in/e9ZbV2GY

The enthusiasm for chiplets has never been higher, and the evolution of the UCIe specification underscores that interest.?Continued advancement in customizable die-to-die interconnects is critical to enabling multi-vendor chiplet ecosystems and products. https://lnkd.in/e8ZiNc-8

As the industry transitions from SoC to chiplet-based architectures, a new Network-on-chip (NoC) technology from our partner Baya Systems has the potential to make things much easier.?