BizLink Group

?? AI-Ready Connectivity: One-Stop Solutions at OFC 2025! ?? Dive into the future of data center infrastructure with BizLink at #OFC25! We're showcasing a comprehensive portfolio of AI-ready connectivity solutions, designed to tackle the surging demands of #AI, cloud, and #HighPerformanceComputing. ???? What’s pivotal for your AI-ready data center? Copper or fiber optic data transmission? PCB scalability or PCIe connectivity? Busbar or cable power supply? We’ve got it all! ??? ?? Explore our cutting-edge offerings: ?? 1.6 T Interconnects: Ultra-low latency, high-bandwidth solutions. ?? ?? AOC & Transceivers: Live demo of the latest technologies. ?? ?? Ultra-Compact WDMs: Including our newly launched High-Density WDM Cassette with 216 LC ports in 1RU! ?? ?? Advanced Power Distribution: OCP rack and power shelf busbars for future energy demands. ? ?? PCIe 5/6 Cable Solutions: High-performance MCIO and DA CEM Riser cables for optimal signal integrity. ?? ?? Join us at #OFC25! ?? Date: April 1–3, 2025 ??Location: Booth 5644/5646, North Hall, Moscone Center, San Francisco We invite you to discuss your connectivity challenges and discover how BizLink can empower your AI-driven future. Meet the BizLink expert team and see #WherePossibilitiesConnect. ?? ?? Check here for more details: https://lnkd.in/gMjECgzF #BizLink #DataCenter

Great partnerships stand the test of time! ?? Our Chairman, Roger, recently joined Baker McKenzie’s 50th-anniversary celebration, reflecting on an 8-year collaboration that started with BizLink’s acquisition of Leoni AG’s Electrical Appliances Business Unit. In 2022, we partnered again for the acquisition of Leoni AG’s Industrial Business Group—a deal made even more challenging by the pandemic. But thanks to Baker McKenzie’s dedication, we successfully navigated the complexities and got it done! ??? A big thank you to the Baker McKenzie team for their unwavering support. Looking forward to many more successful collaborations ahead! ?? #BizLink #MergersAndAcquisitions #Partnership #BakerMcKenzie #Success #Growth #Teamwork

??BizLink presents new ultra-compact WDM cassette at OFC 2025 to increase density in AI-ready data centers ?? Our latest development from a wide variety of fiber optic? #WDM products packs an incredible 216 LC ports into a single 1RU space, solving critical space and installation challenges for AI-ready data centers and telecom networks. ( Check here for more details: https://lnkd.in/g9BW9MWF ) ?? Key Features: ?? Unmatched Density: 216 LC ports in 1RU! ?? ?? Simplified Installation & Scalability: Effortless deployment and flexible expansion. ???? ?? Versatile Configurations: MPO and MMC options for optimal WDM utilization. ?? ?? Ultra-Low Loss WDM: Exceptional reliability and signal integrity. ? This launch highlights BizLink’s broader commitment to providing comprehensive AI-ready connectivity solutions, including 1.6 T interconnects, advanced power systems, and cutting-edge AOC/Transceiver technologies, all designed to meet the increasing demands of modern data centers. ?Join us at #OFC25! ?? Date: April 1–3, 2025 ??Location: Booth 5644/5646, North Hall, Moscone Center, San Francisco Experience the future of connectivity firsthand! Let’s explore #WherePossibilitiesConnect. ?? #BizLink #HighDensity #DataCenter

?? NVIDIA #GTC25 was a great success! ?? ?? Everyone’s collaborative and innovative spirit was contagious! By talking with and learning from our peers and our partners, we’ve gained valuable insights on the new wave of AI innovation, stirred up excitement for the future we’re creating, and made lasting memories. BizLink’s latest high-speed, power dense connectivity solutions will continue to push boundaries and facilitate the AI revolution! ? Thank you NVIDIA for bringing all of us together in San Jose! See you next year! #GTC25 #Innovation #WherePossibilitiesConnect #AI

?? BizLink is proud to be recognized by NVIDIA at #GTC25! ?? ?? Our team members were met with applause when they were invited onto the stage with NVIDIA's hardware management executives. In recognition of the integral part we play in NVIDIA’s AI supply chain, we were personally presented with awards in front of the NVIDIA MGX Ecosystem Wall. It was our great honor to receive this award and partner with NVIDIA in shaping the AI revolution! ?? We're having such a blast at #GTC25, that it's hard to believe there's only one day left to celebrate! Looking forward to seeing everyone tomorrow! ?? Date: March 18–21, 2025 ?? Location: San Jose Convention Center #GTC25 #Innovation #WherePossibilitiesConnect #AI

? BizLink has arrived at NVIDIA #GTC25 with our founders! ? ?? As a proud sponsor of the NVIDIA MGX Ecosystem Wall, we’re honored to be part of the advancements being made in the landscape of AI infrastructure, as highlighted in the #GTC25 keynote. ?? Our founders Roger Liang and Annie Kuo made a surprise appearance today! Our team was excited to show off our products on display. We were so blown away by the hype in the exhibition hall, we even took photos to commemorate this once-in-a-lifetime occasion. Don’t miss your chance to come by and check us out! ?? Date: March 18–21, 2025 ?? Location: San Jose Convention Center #GTC25 #Innovation #WherePossibilitiesConnect #AI

? NVIDIA #GTC25 is here! ? As AI and computing are advancing at an unprecedented pace, BizLink is powering the future with high-speed, power dense connectivity solutions designed for the next wave of AI innovation. We will be showcasing our solutions including: ?? PCIe Gen5/6 High-Speed Internal Interconnect Solutions: Featuring advanced options such as MCIO and DA CEM Riser cables, designed to maximize space and enhance efficiency in AI servers. ? Power Dense Interconnect Solutions: Including 60A AC input connectors, 600A DC busbar connectors, 60A power whips, and 42-48OU rack busbars, ensuring scalable and reliable power for high-capacity data centers. We’re excited to engage with industry leaders and explore the technologies shaping the future. Let’s connect at #GTC25! ?? Read more on our website: https://lnkd.in/d5H2iWQi ?? Date: March 18–21, 2025 ?? Location: San Jose Convention Center #GTC25 #Innovation #WherePossibilitiesConnect #AI

? BizLink is a proud sponsor of NVIDIA #GTC25 next week! ? As AI and computing continue to push boundaries, seamless connectivity and power dense solutions are critical to unlocking innovation. At GTC, we’re excited to showcase our latest high-speed, power dense connectivity solutions designed to support the next generation of AI-driven advancements. ?? PCIe Gen5/6 High-Speed Internal Interconnect Solutions: MCIO and DA CEM Riser cables, designed to maximize space and enhance efficiency in AI servers. ? Power Dense Interconnect Solutions: Including 60A AC input connectors, 600A DC busbar connectors, 60A power whips, and 42-48OU rack busbars, ensuring scalable and reliable power for high-capacity data centers. See you soon at NVIDIA #GTC25! ?? Register now: https://lnkd.in/eZ6534vt ?? Date: March 18–21, 2025 ?? Location: San Jose Convention Center #GTC25 #Innovation #WherePossibilitiesConnect #AI

???? Looking for PFAS-Free Alternatives? BizLink offers a wide range of customized cable solutions designed to meet your needs, with environmental sustainability at the forefront of our priorities. Leveraging our expertise in material selection, design, and processing, we confidently provide individual cable features with different PFAS-free alternatives. For instance, BizLink's manifold silicone cable solutions are extremely heat-resistant and flexible, offering superior durability and reliability without the use of fluoropolymers. These eco-friendly, long-lasting connections serve a more sustainable future for industrial and electrical appliance applications worldwide. ???? Read more on our website: https://lnkd.in/dyc6exvv #BizLink #Sustainability #Cables #Innovation #Connectivity

?? The energy is still heating up at DesignCon！?? Thank you to everyone who visited #BizLink at Booth #749! We had some truly insightful and inspiring conversations about the future of AI, connectivity, and high-performance computing. Your feedback and ideas are invaluable. If you haven't visited us, come today to explore our groundbreaking solutions: from PCIe Gen5/6 Interconnects to 1.6T OSFP DAC Solutions and high-performance flex cables. We will show you how we are enabling the ultra-fast data transmission and AI-powered innovations. ?? Date: January 29–30, 2025 ?? Location: Santa Clara Convention Center ?? Booth No.: 749 #BizLink #DesignCon2025 #AI #Innovation #DataCenters #HighPerformanceComputing #Connectivity