BizLink Group

? BizLink is a proud sponsor of NVIDIA #GTC25 next week! ? As AI and computing continue to push boundaries, seamless connectivity and power dense solutions are critical to unlocking innovation. At GTC, we’re excited to showcase our latest high-speed, power dense connectivity solutions designed to support the next generation of AI-driven advancements. ?? PCIe Gen5/6 High-Speed Internal Interconnect Solutions: MCIO and DA CEM Riser cables, designed to maximize space and enhance efficiency in AI servers. ? Power Dense Interconnect Solutions: Including 60A AC input connectors, 600A DC busbar connectors, 60A power whips, and 42-48OU rack busbars, ensuring scalable and reliable power for high-capacity data centers. See you soon at NVIDIA#GTC25! ?? Register now: https://lnkd.in/eZ6534vt ?? Date: March 18–21, 2025 ?? Location: San Jose Convention Center #GTC25 #Innovation #WherePossibilitiesConnect #AI

???? Looking for PFAS-Free Alternatives? BizLink offers a wide range of customized cable solutions designed to meet your needs, with environmental sustainability at the forefront of our priorities. Leveraging our expertise in material selection, design, and processing, we confidently provide individual cable features with different PFAS-free alternatives. For instance, BizLink's manifold silicone cable solutions are extremely heat-resistant and flexible, offering superior durability and reliability without the use of fluoropolymers. These eco-friendly, long-lasting connections serve a more sustainable future for industrial and electrical appliance applications worldwide. ???? Read more on our website: https://lnkd.in/dyc6exvv #BizLink #Sustainability #Cables #Innovation #Connectivity

?? The energy is still heating up at DesignCon！?? Thank you to everyone who visited #BizLink at Booth #749! We had some truly insightful and inspiring conversations about the future of AI, connectivity, and high-performance computing. Your feedback and ideas are invaluable. If you haven't visited us, come today to explore our groundbreaking solutions: from PCIe Gen5/6 Interconnects to 1.6T OSFP DAC Solutions and high-performance flex cables. We will show you how we are enabling the ultra-fast data transmission and AI-powered innovations. ?? Date: January 29–30, 2025 ?? Location: Santa Clara Convention Center ?? Booth No.: 749 #BizLink #DesignCon2025 #AI #Innovation #DataCenters #HighPerformanceComputing #Connectivity

??BizLink is excited to welcome you to Booth #749 at the Santa Clara Convention Center. Today, we've had some great and insightful discussions with industry experts, sharing knowledge and exploring the future of AI. ?? Don't miss out on the opportunity to witness these groundbreaking technologies in action. Let's shape the future together! ? ?? Date: January 29–30, 2025 ?? Location: Santa Clara Convention Center ?? Booth No.: 749 #BizLink #DesignCon2025 #AI #Innovation #DataCenters #HighPerformanceComputing #Connectivity

?? Get Ready for DesignCon 2025! ?? The excitement is building as DesignCon 2025 is just around the corner, and BizLink is thrilled to connect with you! Join us at Booth #749 at the Santa Clara Convention Center where our team is ready to share insights, discuss the future of AI, and showcase our cutting-edge innovations in high-performance computing and connectivity. ?? From PCIe Gen5/6 Interconnects to 1.6T OSFP DAC Solutions, advanced power solutions, and high-performance flex cables, we have a lot in store. Discover how BizLink’s solutions are driving the next era of ultra-fast data transmission and empowering AI connections. Come visit us to see these groundbreaking technologies in action. Let’s shape the future together! ?? Date: January 29–30, 2025 ?? Location: Santa Clara Convention Center ?? Booth No.: 749 #BizLink #DesignCon2025 #AI #Innovation #DataCenters #HighPerformanceComputing #Connectivity

?? BizLink at DesignCon 2025 ?? We are excited to announce our participation in DesignCon 2025, where we’ll be showcasing groundbreaking innovations in high-performance computing and connectivity. Visit us to explore how we’re shaping the future of AI and ultra-fast data transmission. ?? Key Highlights: - PCIe Gen5/6 High-Speed Internal Interconnect Family: Maximize space and efficiency in AI servers. - 1.6T OSFP DAC Solutions: Ultra-high-speed connectivity for next-gen networking. - Robust Power Solutions: Scalable power for high-capacity data centers. - High-Performance Flex HPF Cable: 150 million flex cycles for robotics & industrial applications. - Cleanroom-grade IDC PTFE Ribbon Cables: Unmatched reliability in specialized environments. Our experts will be at the booth, ready to engage in insightful discussions and demonstrate how BizLink’s innovations empower AI connections and unlock endless possibilities! Check here for more details: https://lnkd.in/gCeD8yZ7 ?? Date: January 29–30, 2025 ?? Location: Santa Clara Convention Center ?? Booth No.: 749 #BizLink #DesignCon2025 #AI #Innovation #DataCenters #HighPerformanceComputing #Connectivity

?? A Remarkable Experience at CES2025 What an extraordinary event! At CES 2025, BizLink proudly showcased our latest innovations, including Smart Driving & Cockpit Solutions, AI-Powered Data Centers, and Compact EV Charging Solutions. We sincerely thank all the visitors, partners, and industry leaders who visited our booth and contributed to making this event a truly inspiring exchange of ideas and technologies. ?? As we move forward, we're excited to continue shaping the future of AI-Driven Data Center solutions and Smart Mobility innovations across industries. ?? Stay tuned for what's next! #BizLink #CES2025 #TechInnovations #SmartMobility #AIDataCenters #FutureTech

?? Don't Miss Out: Explore the AI Era with BizLink at CES 2025! Feeling as inspired as we are after the #NVIDIAKeynote ? It was an amazing display of AI's transformative power!? We are also?excited to show you how BizLink's solutions are seamlessly connecting the AI era: ?Smart Driving & Cockpit Solutions for next-level in-car experiences. ?AI-Powered Data Centers with high-speed interconnects up to 800 Gbps. ?AI-Assisted Industrial Automation for smarter, data-driven operations. Tomorrow is the final day of CES 2025—if you haven't visited BizLink yet, be sure to stop by! ?? Date: January 7–10, 2025 ?? Location: North Hall, LVCC Campus (Las Vegas Convention Center) ?? Booth Number: 9871 #BizLink #CES2025 #SmartDriving #SmartCockpit #AIDataCenters #AIRobotics #TechInnovations

???? The Future is Here with BizLink at CES 2025! At CES 2025, we're showcasing a comprehensive range of solutions that are transforming industries: ?Pioneering IT and AI-Driven Innovation? ?AI Data Centers: High-performance interconnects optimized for up to 800 Gbps transmission, empowering AI-driven workloads. ?AI-Assisted Video Conferencing Systems: Seamlessly enabling intelligent collaboration for modern workplaces. ?AI Accelerators: Featuring transformative technologies like the S-Parameters AI Predictive System and AI-Assisted Robotic Arm for advanced automation. ?Redefining Smart Mobility and EV Ecosystems? ?Smart Driving & Cockpit Solutions: Elevating in-car experiences for drivers and passengers. ?EV Charging Solutions: Compact Portable xEV Chargers and NACS Charging Couplers designed for diverse EV needs. ?High-Performance Automotive Electronics: Reliable, high-speed interconnects tailored for advanced vehicles. ?The future isn't just coming - it's already here!? Come to visit us ?? ?? Date: January 7–10, 2025 ?? Location: North Hall, LVCC Campus (Las Vegas Convention Center) ?? Booth Number: 9871 #BizLink #CES2025 #TechInnovations #FutureTech #Innovation #ConnectivitySolutions

?? A Sneak Peek of BizLink's Day One at CES 2025! Step into the future of connectivity with BizLink at CES 2025. We're showcasing groundbreaking innovations in Automotive, Data Centers, IT Infrastructure, and Industrial Solutions, redefining the industries of tomorrow with cutting-edge solutions. Explore how we're pushing the boundaries of innovation: ?Smart Driving & Cockpit Solutions: Enhancing in-car experiences through seamless integration of intelligent systems. ?AI-Powered Data Center Interconnects: Delivering high-speed, scalable solutions to efficiently power AI-driven workloads. Stop by our booth to learn more and pick up some exclusive BizLink swag?? We can't wait to meet you there! ?? ?? Date: January 7–10, 2025 ?? Location: North Hall, LVCC Campus (Las Vegas Convention Center) ?? Booth Number: 9871 #BizLink #CES2025 #TechInnovations #FutureTech #Innovation #ConnectivitySolutions