Baya Systems is driving the next wave of foundational chiplet-based, high-performance, and modular semiconductor systems, with a focus on best-in-class on-chip fabric and communication technologies. By enabling seamless interoperability across a diverse array of industry-standard protocols, Baya Systems empowers best-of-breed compute, communication, and I/O solutions to work together. This approach enhances performance, yield, reusability, composability, development time and cost-efficiency. Named for the Baya bird, renowned for weaving cohesive nests from various materials, Baya Systems embodies this spirit of integration and efficiency. Backed by leading investors Matrix Partners and Intel Capital, Baya Systems is transforming intelligent compute. For more information, visit https://www.bayasystems.com or follow us on Twitter: https://twitter.com/bayasystems.
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Day 2 at embedded world Exhibition&Conference 2025 drawing to a close. Another Busy day in “Startup City” for Baya Systems. A lot of interesting conversations and friendly faces including Sander Arts our partners at Semidynamics. Being across from Fabrizio Del Maffeo and Axelera AI’s impressive showing always increases visibility and foot traffic.
“We welcome Baya Systems, which joins a rapidly growing set of game changers meeting the challenges of AI scaling.” - Peter Onufryk, president of the Ultra Accelerator Link Consortium * Our newly-announced NeuraScale? switch fabric is built not only to support future UALink compliance, but future Universal Chiplet Interconnect Express (UCIe) and Ultra Ethernet Consortium compliance as well. This flexibility is a key component of our new fabric's ability to support next-gen AI scale-up and scale-out.? * Sheryl Miles from Electronic Specifier Ltd has more: https://lnkd.in/gpTSkifq * #semiconductors #chips #artificialintelligence
Over the last decade, the need for advanced compute, especially for #AI, has consistently grown. Being extremely data intensive though, the leaders that have emerged have been extremely successful in parallelisation and efficient data movement. The key to scale has been in the network, as thesuccess of #NVLink has clearly shown. Standards like #UALink, and #UEC are emerging for a broader #scale-up and #scale-out, but the demands of scale require quite a substantial change in how to approach switching. With #NeuraScale, Baya Systems, is focused on enabling the next-generation of switching solutions, with versatile on-die fabric that provides the non-blocking capabilities of cross bar, while substantially improving implementation, scale and time to market. This not only gives boost to existing designs butis future-looking to beyond the current limitations of SoCs or chiplet reticle limits.
It’s an honor and a privilege to announce Baya Systems NeuraScale? Fabric, a groundbreaking switch fabric technology designed to solve the critical scale-up and scale-out challenges in modern AI and compute infrastructure. #NeuraScale redefines what’s possible, delivering a non-blocking design supporting 256 Tbps ports per chiplet and scaling linearly with chiplets, thus enabling a 100x increase in node density over today’s systems. With 2+ GHz operation in 4nm, latency close to the Manhattan distance wire delay, and a 2048-bit data path, it achieves KPIs that traditional memory based crossbars can’t match. It’s modular, PD-friendly – assembled from a sub-1sqmm tile via simple abutment – and protocol-ready for #AMBA, #UALink, #UEC, and #UCIe. This is a radical leap forward for AI infrastructure, empowering unprecedented performance, energy efficiency, and scalability. I’ve been a networking guy from the start – my PhD in networking and early days at Cisco and Huawei, collaborating with legendary researchers and architects like Prof. Jon Turner, Will Eatherton, Pere Monclus, and Bill Lynch, Ph.D. shaped my passion for data movement. After diving into compute silicon, on-chip interconnects, and coherency, NeuraScale feels like a homecoming. It’s humbling to watch Baya engineers create a technology that transcends the limits of legacy crossbars, which have long been central to both networking and AI system design. With NVIDIA #NVLink showing the power of high-performance fabrics and the #UALink Consortium now driving an open ecosystem, NeuraScale arrives at the perfect moment to accelerate this wave of innovation. At Baya, we’re thrilled to collaborate with a lead partner leveraging NeuraScale to design leadership systems, with broader availability coming in late 2025. Paired with our #WeaverPro platform, it slashes development time, simplifies large scale interconnects, and ensures interoperability for AI-driven data centers. This isn’t just an evolution, it’s a revolution in how we scale AI, and it’s a privilege to bring it to life. Returning to the roots, working with Baya’s outstanding team, building on the wisdom of the giants who shaped us feels profoundly rewarding. With humility, I can say we’re just getting started at Baya, pushing the envelope of data movement in every market segment. ???Read more about NeuraScale and its impact: https://lnkd.in/gvv9ytyy #AI #Networking #ScaleUp #ScaleOut #Chiplet #NeuraScale
Baya Systems转发了
It’s an honor and a privilege to announce Baya Systems NeuraScale? Fabric, a groundbreaking switch fabric technology designed to solve the critical scale-up and scale-out challenges in modern AI and compute infrastructure. #NeuraScale redefines what’s possible, delivering a non-blocking design supporting 256 Tbps ports per chiplet and scaling linearly with chiplets, thus enabling a 100x increase in node density over today’s systems. With 2+ GHz operation in 4nm, latency close to the Manhattan distance wire delay, and a 2048-bit data path, it achieves KPIs that traditional memory based crossbars can’t match. It’s modular, PD-friendly – assembled from a sub-1sqmm tile via simple abutment – and protocol-ready for #AMBA, #UALink, #UEC, and #UCIe. This is a radical leap forward for AI infrastructure, empowering unprecedented performance, energy efficiency, and scalability. I’ve been a networking guy from the start – my PhD in networking and early days at Cisco and Huawei, collaborating with legendary researchers and architects like Prof. Jon Turner, Will Eatherton, Pere Monclus, and Bill Lynch, Ph.D. shaped my passion for data movement. After diving into compute silicon, on-chip interconnects, and coherency, NeuraScale feels like a homecoming. It’s humbling to watch Baya engineers create a technology that transcends the limits of legacy crossbars, which have long been central to both networking and AI system design. With NVIDIA #NVLink showing the power of high-performance fabrics and the #UALink Consortium now driving an open ecosystem, NeuraScale arrives at the perfect moment to accelerate this wave of innovation. At Baya, we’re thrilled to collaborate with a lead partner leveraging NeuraScale to design leadership systems, with broader availability coming in late 2025. Paired with our #WeaverPro platform, it slashes development time, simplifies large scale interconnects, and ensures interoperability for AI-driven data centers. This isn’t just an evolution, it’s a revolution in how we scale AI, and it’s a privilege to bring it to life. Returning to the roots, working with Baya’s outstanding team, building on the wisdom of the giants who shaped us feels profoundly rewarding. With humility, I can say we’re just getting started at Baya, pushing the envelope of data movement in every market segment. ???Read more about NeuraScale and its impact: https://lnkd.in/gvv9ytyy #AI #Networking #ScaleUp #ScaleOut #Chiplet #NeuraScale
Exciting news from Baya Systems! Today, we unveiled NeuraScale? Scalable Switch Fabric—a groundbreaking switch fabric technology set to redefine #AI #Infrastructure. With a 100x increase in node density and scale, the NeuraScale switch fabric tackles the toughest challenges in data movement, delivering non-blocking performance for next-gen AI systems. Key highlights: ·?????Radical scalability: 256 ports/chiplet, 1 Tb/s throughput ·?????Blazing performance: 2 GHz+ in 4nm tech, <20 ns latency ·?????Chiplet-ready modularity + multi-protocol support (AMBA, UALink?, UCIe, Ultra Ethernet-ready) ·?????Paired with WeaverPro software for faster, KPI-driven design ·?????Implementation friendly, improves TTM As AI workloads push the limits of traditional interconnects, the NeuraScale switch fabric offers a fresh, energy-efficient approach to scale-up and scale-out. Proud to see our team’s innovation already powering collaborations with lead partners—available to the ecosystem in Q2 2025. Learn more: https://bit.ly/3Xub7F0 #Semiconductors #Innovation #Tech #Chiplets #DataCenter #Infrastructure
Following the recent Q&A interview with Baya Systems CCO Nandan Nayampally, The Volt Post covered our latest collaboration announcement with Semidynamics. This collaboration represents a significant step forward in advancing high-performance, scalable computing architectures for AI, ML, and HPC applications. See what they had to say:
“Our customers need high-performance compute that doesn’t get bottlenecked by inefficient data transport,” said Roger Espasa, CEO of Semidynamics. “Partnering to pre-integrate with Baya Systems’ WeaveIP? technology accelerates development timelines for our mutual customers, eliminating this bottleneck and enabling a new level of performance for #AI and #HPC applications.” “Our mission is to support our customers’ #processorIP choices while providing the #SoC connectivity backbone for the expanding #RISCV ecosystem,”?said Dr. Sailesh Kumar | CEO | Baya Systems. “Together with Semidynamics, we’re enabling #SoCdesigners to push the boundaries of performance, efficiency and scalability in AI and HPC applications.” To Know More: https://lnkd.in/g8-RUjhy
Great to have Semidynamics partnering with us. Look forward to working with Roger Espasa and his talented team on their foray into #AI #ML #HPC.
Baya Systems & Semidynamics: Advancing AI, ML, and HPC with Smarter Data Movement? ? As AI, ML, and HPC workloads scale, the focus is shifting from raw compute power to efficient data movement across processors and chiplets. To meet this challenge, Baya Systems and Semidynamics are collaborating to deliver next-generation, high-performance computing architectures.? ? This collaboration integrates Semidynamics’ customizable 64-bit RISC-V processor IP with Baya’s WeaveIP Network on Chip (NoC) system IP, enabling ultra-efficient, high-bandwidth, and low-latency data transport. Baya’s WeaverPro platform further optimizes real-world workloads, ensuring systems achieve key performance metrics with flexibility for future advancements.? ? With increasing demands in data centers, infrastructure, automotive, and edge IoT, this collaboration paves the way for hyper-efficient AI and ML platforms.? ? Learn more about how Baya Systems and Semidynamics are shaping the future of intelligent compute. https://bit.ly/4h90a2G #AI #ML #HPC #RISC_V #Semiconductors #Chiplets
Baya Systems & Semidynamics: Advancing AI, ML, and HPC with Smarter Data Movement? ? As AI, ML, and HPC workloads scale, the focus is shifting from raw compute power to efficient data movement across processors and chiplets. To meet this challenge, Baya Systems and Semidynamics are collaborating to deliver next-generation, high-performance computing architectures.? ? This collaboration integrates Semidynamics’ customizable 64-bit RISC-V processor IP with Baya’s WeaveIP Network on Chip (NoC) system IP, enabling ultra-efficient, high-bandwidth, and low-latency data transport. Baya’s WeaverPro platform further optimizes real-world workloads, ensuring systems achieve key performance metrics with flexibility for future advancements.? ? With increasing demands in data centers, infrastructure, automotive, and edge IoT, this collaboration paves the way for hyper-efficient AI and ML platforms.? ? Learn more about how Baya Systems and Semidynamics are shaping the future of intelligent compute. https://bit.ly/4h90a2G #AI #ML #HPC #RISC_V #Semiconductors #Chiplets
Baya Systems转发了
At?Baya Systems, we believe that?#people and #culture?are at the heart of success. The right team, built on transparency, meritocracy, and shared purpose, is what drives real impact. Thank you Justin Kinsey for taking the time for candid, and honest conversation on this topic. If you're interested in how we are shaping the future of #AI hardware, or are curious about the culture that fuels our mission, watch the full conversation here: ???https://lnkd.in/gZ5mUz2H We’re?growing fast?and?#hiring?in the?Bay Area, Austin, Bangalore, and the UK. If you want to be part of a team that’s redefining silicon for the AI era, let’s talk! ??
President at SBT | 19 years of advising leaders in the semiconductor industry and architecting teams from startups to F500 companies
I’ve said this before, and I’ll KEEP saying it—because it matters: The companies that will define AI’s future aren’t just chasing market share—they’re enabling the ENTIRE ecosystem. The real leaders don’t operate with a “zero-sum” mindset, where success means “we win, or nobody does.” Instead, they recognize that AI’s evolution—and responsible, scalable deployment—depends on a network of innovators pushing boundaries. That’s why I was excited to finally sit down with Sailesh Kumar, CEO of Baya Systems. I first heard about Baya?when they were still in stealth, but had enough insight about their potential to make an impact that they made my Top 13 AI/ML Startups to Bet On list. That was all confirmed upon meeting Sailesh in Baya’s offices - I got a “backstage pass” to experience how passionate and committed he and his team are to solving one of AI’s biggest bottlenecks that all HW companies are struggling with. For decades, semiconductor progress followed a predictable cadence—new chips doubled in performance, and software adapted. But today, that paradigm has flipped. AI models are outpacing hardware, and data movement—not just raw compute—is now the constraint and that’s exactly where Baya is making their impact felt. As Sailesh put it: “Our mission is to accelerate data movement for intelligent compute... and I believe we will be on this journey for years, if not decades.” As AI applications push further, hardware has to scale in ways we haven’t seen before—but true scalability requires flexibility. And if there’s one thing large compute-hardware companies don’t love, it’s flexibility. It takes a different kind of mindset—one that prioritizes co-development across software, hardware, and infrastructure—to truly drive progress. That’s Baya’s focus. I’m extremely grateful to Sailesh for sharing his experience, insights and time so that we can all benefit. Now I think the question that remains is: As AI’s compute demands explode, where will the biggest value be created? If the real opportunity isn’t in raw compute, is it in reimagining how the entire stack comes together? I welcome your thoughts. #semiconductorindustry #artificialintelligence #HWSWcodesign
Baya Systems CEO Sailesh Kumar on EDA Cafe: Solving AI’s Biggest Challenge AI architectures are evolving rapidly, but the industry’s biggest bottleneck is no longer compute power—it’s data movement and connectivity. Baya Systems, founded in 2023, is tackling this challenge head-on with IP subsystems designed to accelerate data movement, enabling scalable, high-performance AI systems. On the latest episode of EDA Cafe, Baya Systems CEO Sailesh Kumar sits down with Sanjay Gangal to discuss how the company is addressing this critical shift. With Series A and B funding secured, a world-class team, and products already in customers’ hands, Baya Systems is driving a software-driven, system-level approach to interconnect solutions. By supporting emerging standards like UL Link and chiplet integration technologies like UCIE, Baya is at the forefront of enabling next-generation semiconductor design. Learn how Baya Systems is redefining AI infrastructure. Watch now: https://bit.ly/4ibaWWW #AI #Semiconductors #Chiplets #DataMovement #EDA #HPC