Averatek的封面图片
Averatek

Averatek

计算机和电子制造业

Santa Clara,CA 1,025 位关注者

Novel chemistries for advanced semiconductor packaging and substrates driven by AI and high performance computing.

关于我们

Averatek Corporation develops and licenses key chemistries and advanced manufacturing processes for a variety of electronic products including: very high density printed circuit boards, semiconductor packaging, soldering to aluminum, RF and millimeter wave passive components. Please visit our website for the latest news and participation in upcoming events. www.Averatek.com

网站
https://www.averatek.com
所属行业
计算机和电子制造业
规模
11-50 人
总部
Santa Clara,CA
类型
私人持股
领域
Precursor Ink、Fine Line Flex、3D Metallization、Conductive Fabric、RFID Materials、Additive Electronics、HDI和Advanced Packaging

地点

  • 主要

    550 Nuttman Street

    US,CA,Santa Clara,95054

    获取路线

Averatek员工

动态

  • Averatek转发了

    查看CM Venture Capital的组织主页

    714 位关注者

    CM portfolio company Averatek has officially rebranded itself as LQDX (‘lik-WID-ix), as part of their pivot to focus on the semiconductor packaging industry. CM Venture Capital's CEO Dr Min Zhou had worked closely with the company over the last 12 months to co-develop the new direction and form the new team. ? ? To fund its next stage of growth, LQDX has concluded a combined equity and initial government funding round of $10M USD. ? LQDX has made updates to its corporate governance and executive staff, naming Simon McElrea as Director & CEO, Rozalia Beica as Chief Commercial Officer and Dr Scott Meikle as Executive Chairman. ? This is a pivotal moment for LQDX and the semiconductor industry as they ready themselves for the unprecedented inflection of AI and High-Performance Computing. ? At the core of LQDX’ portfolio lies?LMIx??– or Liquid Metal Ink??technology – a novel metallization chemistry suite that enables the production of circuits up to 250 times denser than conventional Printed Circuit Boards (PCBs) and the most advanced interconnects used as redistribution lines (RDLs) for chiplet integration and 3D die stacking using through-silicon-vias (TSVs) These advanced features, previously exclusive to silicon, are essential to meet the exponential growth demand in signal density required by advanced chips, chiplets and heterogeneous integration. Announcement on CM site: https://lnkd.in/g3c4g7pp LQDX press release: https://lnkd.in/guuYcWBg #PCB #AI #printedcircuitboards #liquidmetal #rebrand

    查看LQDX的组织主页

    808 位关注者

    Todays is the day. We welcome LQDX, pronounced ‘lik-WID-ix’. Our new brand (https://LQDX.com) represents many things: new team, new funding, and a reengineering of our business at the most pivotal moment in semiconductor industry history. We’ve a lot more to announce on partnerships over the next few weeks, so please stay tuned. Reach out if you want to learn more. Or find your Liquid-X at https://LQDX.com.

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  • 查看Averatek的组织主页

    1,025 位关注者

    Thanks to the Surface Mount Technology Association (SMTA) for inviting me and Averatek to take part in the Ultra-HDI panel in Peoria AZ this week - the new center of the silicon universe with Amkor Technology, Inc. and TSMC joining the neighborhood. Combined with the iMAPS show in AZ last week and the groundbreaking Deca Technologies / Arizona State University announcement, it’s clear that the money and the focus is flowing into the US right now, but we need to motivate the next generation of students to join the industry en masse, or it will be a difficult ramp!

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