Arieca is a leader in advanced thermal interface materials (TIMs) for cooling of high-performance semiconductor chips. Our patented Liquid Metal Embedded Elastomer (LMEE) technology delivers an unprecedented combination of thermal efficiency and mechanical reliability that enables the sustainable use of next generation AI, SiC, and other heat-generating semiconductor chips for automotive, consumer, datacenter, and other applications.
Arieca Inc.的外部链接
US，PA，Pittsburgh，15206
Find Toby Mea and Roshan Sameer Annam for a demonstration of Liquid Metal Embedded Elastomers at SEMI-THERM! #thermalmanagement #coolingsolutions #innovation
Live from SEMI-THERM 2025! We’re here at Booth 309 showcasing Arieca’s cutting-edge Liquid Metal Thermal Interface Materials for the high-performance computing and power electronics cooling. Stop by to see our materials live in action, learn how we’re pushing the boundaries of thermal management, and connect with our team.
Great interview in Semiconductor Engineering with Arieca Inc. board member Mr. Ken Joyce, (by Jessica Albright, MBA?from Brewer Science), reflecting on lessons from industry pioneers and the future of advanced packaging. As heterogenous, 2.xD and 3.xD chiplet packaging evolves to enhance speed, functionality, and thermal management, Ken shares insights from his experiences shaping this field. Arieca is pushing the boundaries of thermal management, enabling advanced semiconductor packaging to deliver maximum computational performance while allowing sustainable cooling energy consumption. Read the full article: https://lnkd.in/eaaan6MR
Arieca is heading to the SEMI-THERM symposium in San Jose from March 10-13, 2025! Don’t miss the chance to see Arieca’s unique Liquid Metal Embedded Elastomer (LMEE) TIMs in person in?Booth #309?and to learn more about our technology in presentations from Arieca and our partners at CMU. Are you attending? Let us know and let’s meet up! #SEMI-THERM #thermalmanagement #liquidmetal #advancedpackaging
We are excited that Arieca polymer scientist Dr. Swagata Mondal will be speaking at?International Microelectronics Assembly and Packaging Society (IMAPS)?Device Packaging Conference 2025 in Phoenix. Don’t miss your opportunity to learn how Arieca’s Liquid Metal Embedded Elastomer (LMEE) TIMs are revolutionizing semiconductor cooling – enabling ultra-low thermal resistance and thin BLTs while overcoming the manufacturing and reliability challenges of standard liquid metal TIMs.?? ? Presentation:??Highly Accelerated Stress Testing (HAST) of Liquid Metal-Based Thermal Interface Materials Date:?March 4, 2025 Time:?3:00 PM Who else is attending IMAPS DPC 2025? Drop a comment and let’s meet up! ? #DPC2025 #ThermalManagement #LiquidMetal #AdvancedPackaging #ElectronicsCooling #Semiconductors
Arieca Inc.转发了
Thank you to everyone who joined us for another amazing holiday party! ??? It was such a joy to celebrate the season together with great food and even better company. A heartfelt shoutout to Carmel Majidi & the Carnegie Mellon University Soft Machines Lab, Arieca Inc., and ESTAT Actuation—our shared journey makes gatherings like this even more meaningful. Happy Holidays to all! ??
We are happy to play an important role in the cooling of next generation advanced semiconductor packaging. Thank you TDK Ventures for including us.
Semiconductor chip development continues to advance rapidly, with transistors getting smaller and more densely packed onto increasingly larger dies. However, this progress also leads to a growing challenge: more heat generation. For instance, the thermal design power of Nvidia’s Blackwell system has tripled compared to its previous generation. (See the comments below for our full updated graphic of the ecosystem.) To ensure chip reliability, advanced cooling solutions are being developed, which include both passive and active methods. Passive cooling refers to solutions that remove heat from the chip without the need for energy input. A key example is thermal interface materials (TIMs), which are used to transfer heat from the die to the chip package and then to the external heat sink. As heat sink designs become more advanced—like the products from our portfolio company Fabric8Labs—thermal interface materials could become the bottleneck in cooling chips. This is why many startups are innovating in high thermal conductivity and low thermal resistance materials for better transferring heat away from the die. NovoLINC, Boston Materials, Arieca Inc., apheros, Maxwell Labs, Carbice. Active cooling uses energy to extract heat, either in a direct-to-chip manner like JETCOOL Technologies Inc., NEXALUS, Chilldyne, DCX LIQUID COOLING SYSTEMS, ZutaCore, Accelsius, SEGUENTE are working on, or through immersion cooling like Submer, LiquidStack, Green Revolution Cooling, Iceotope Technologies Limited, and Ferveret, Arctic impulse Oy, Asperitas, GREENTECH Technologies AG. Our investment director, Tina Tosukhowong, takes a deep into these active cooling solutions in her recent “King of Hill in Data Center Cooling” article in DatacenterDynamics. https://lnkd.in/gqk6Dfhx We believe both passive and active cooling technologies are crucial for effectively managing the heat generated by the next generation chips and would love to exchange notes with anyone who is also diving into this space. Yan Yan, Tina Tosukhowong, and Qianran (Katherine) He, PhD continue to explore this market and welcome any additional insights. #ChipCooling #DataCenterEnergy #NextGenChip
We’re ready to add value by enhancing energy efficiency with our adaptable thermal interface materials. Contact us to sample our latest liquid metal-based TIMs for your applications!
The keynote talks at the opening morning of Open Compute 2024 are inspiring, highlighting the deep collaboration needed to scale data centers and AI factories with efficient design and energy consumption. Excited to explore the exhibition hall and connect with the key players driving this innovation! DM/text me if you are around.
Arieca is #hiring! We're looking to add one Mechanical Engineer to our team, to help us test our liquid metal embedded elastomer materials and serve our customers in the semiconductor, electronics, automotive, and healthcare industries. If you or someone you know would be interested, please apply at the link below! #semiconductor #powerelectronics #thermal #LiquidMetal
Over the past few years, SEMI-THERM has evolved into a key forum for exchanging ideas on liquid metal technologies for thermal and electrical applications in the #semiconductor industry. Arieca is excited to participate again this year and looks forward to connecting with colleagues from both academia and industry. Let’s explore and share insights on the latest developments in Liquid Metal technology together!
?? CALL FOR 2-PAGE ABSTRACT - Liquid Metals ?? For more than two decades, Gallium-based liquid metal alloys have captured the imagination of scientists and engineers aiming to disrupt applications in the semiconductor industry. These alloys are highly attractive due to their excellent electrical and thermal conductivity (σ = 3.46 × 10^6 S/m, and k = ~26.4 W/m·K), low melting temperature (Tm = ~15°C), negligible vapor pressure, and low toxicity. However, more research and investigation are needed to achieve the promising performance in commercial applications, whether as thermal interface materials or electrical interconnects. We invite industry leaders, academic researchers, and students to submit their 2-page abstracts for an engaging technical session focused on the challenges and advancements of using liquid metals in semiconductor industry. ? Deadline: October 1, 2024 Share your insights, become a thought leader, and drive the future of thermal management in electronics! For further information, please reach out to Dr. Navid Kazem (Topic Champion / Program Chair). Submit Now! ?? https://lnkd.in/eFRwkKJf #SEMITHERM2025 #ThermalManagement #CallForPapers
Check out this great coverage of our recent Advanced Funcional Materials Article, where we collaborated with Carnegie Mellon University to make bodyheat-powered electronics. It includes a summary as well as interviews to contextualize the SEMI funded research. #stretchableelectronics #science #advancedmaterials #wearables Journal paper: https://lnkd.in/ewhxWdPf
Below is a recent article on TEGsense that may be of interest. https://lnkd.in/eu9_Dek7