Arieca Inc.

Semiconductor chip development continues to advance rapidly, with transistors getting smaller and more densely packed onto increasingly larger dies. However, this progress also leads to a growing challenge: more heat generation. For instance, the thermal design power of Nvidia’s Blackwell system has tripled compared to its previous generation. (See the comments below for our full updated graphic of the ecosystem.) To ensure chip reliability, advanced cooling solutions are being developed, which include both passive and active methods. Passive cooling refers to solutions that remove heat from the chip without the need for energy input. A key example is thermal interface materials (TIMs), which are used to transfer heat from the die to the chip package and then to the external heat sink. As heat sink designs become more advanced—like the products from our portfolio company Fabric8Labs—thermal interface materials could become the bottleneck in cooling chips. This is why many startups are innovating in high thermal conductivity and low thermal resistance materials for better transferring heat away from the die. NovoLINC, Boston Materials, Arieca Inc., apheros, Maxwell Labs, Carbice. Active cooling uses energy to extract heat, either in a direct-to-chip manner like JETCOOL Technologies Inc., NEXALUS, Chilldyne, DCX LIQUID COOLING SYSTEMS, ZutaCore, Accelsius, SEGUENTE are working on, or through immersion cooling like Submer, LiquidStack, Green Revolution Cooling, Iceotope Technologies Limited, and Ferveret, Arctic impulse Oy, Asperitas, GREENTECH Technologies AG. Our investment director, Tina Tosukhowong, takes a deep into these active cooling solutions in her recent “King of Hill in Data Center Cooling” article in DatacenterDynamics. https://lnkd.in/gqk6Dfhx We believe both passive and active cooling technologies are crucial for effectively managing the heat generated by the next generation chips and would love to exchange notes with anyone who is also diving into this space. Yan Yan, Tina Tosukhowong, and Qianran (Katherine) He, PhD continue to explore this market and welcome any additional insights. #ChipCooling #DataCenterEnergy #NextGenChip

The keynote talks at the opening morning of Open Compute 2024 are inspiring, highlighting the deep collaboration needed to scale data centers and AI factories with efficient design and energy consumption. Excited to explore the exhibition hall and connect with the key players driving this innovation! DM/text me if you are around.

?? CALL FOR 2-PAGE ABSTRACT - Liquid Metals ?? For more than two decades, Gallium-based liquid metal alloys have captured the imagination of scientists and engineers aiming to disrupt applications in the semiconductor industry. These alloys are highly attractive due to their excellent electrical and thermal conductivity (σ = 3.46 × 10^6 S/m, and k = ~26.4 W/m·K), low melting temperature (Tm = ~15°C), negligible vapor pressure, and low toxicity. However, more research and investigation are needed to achieve the promising performance in commercial applications, whether as thermal interface materials or electrical interconnects. We invite industry leaders, academic researchers, and students to submit their 2-page abstracts for an engaging technical session focused on the challenges and advancements of using liquid metals in semiconductor industry. ? Deadline: October 1, 2024 Share your insights, become a thought leader, and drive the future of thermal management in electronics! For further information, please reach out to Dr. Navid Kazem (Topic Champion / Program Chair). Submit Now! ?? https://lnkd.in/eFRwkKJf #SEMITHERM2025 #ThermalManagement #CallForPapers

Below is a recent article on TEGsense that may be of interest. https://lnkd.in/eu9_Dek7

Peoria City Council Approves Development Agreement Paving The Way For Amkor Technology, Inc.’s Advanced Semiconductor Packaging And Test Facility The?Peoria City Council approved a Development Agreement with Tempe-based Amkor Technology, at the Tuesday night Regular Council Meeting, for the future location of their state-of-the-art advanced semiconductor packaging and test campus. Through the agreement Amkor has committed to develop the largest outsourced semiconductor packaging and test (#OSAT) facility in the United States, representing a $2 billion multi-phase investment in #Peoria, adding 2,000 new local jobs. The public infrastructure associated with the project, to be located in FIVE NORTH at VISTANCIA, a 320-acre mixed-use lifestyle and employment core, will be constructed and reimbursed by a three-way Joint Development Agreement with Vistancia Development LLC, #Amkor and the city of Peoria, of which the city will reimburse up to $3 million toward the cost of the public infrastructure. “Peoria is proud to be part of our country’s commitment to expand #semiconductor advanced manufacturing and related industries here in the United States,” said Mayor Jason Beck. “Amkor is a great partner that will bring high-quality jobs and products to our community. I’m proud of Peoria’s team for the work they have done to bring these high-quality jobs back to America, the state of #Arizona, and the hard-working people of Peoria.” “Amkor’s new facility in #Peoria represents a pivotal milestone in advancing semiconductor #manufacturing within the United States,” said Giel Rutten, Amkor’s president and chief executive officer. “We are excited and proud to help spearhead the development of a robust American semiconductor #ecosystem here in the heart of the #SiliconDesert.” Read the full press release at https://lnkd.in/gZaSBVw9 To learn more about Amkor, visit https://amkor.com #semiconductors #semiconductorindustry #semiconductormanufacturing #semiconductorjobs #semiconductortechnology #electronicsmanufacturing #electronicsindustry #CHIPSAct #CHIPSforAmerica