Thank you to everyone who visited Amkor's booth at IC China 2024 and attended Eric Hsiung's presentation on “An #OSAT Perspective of the AI #Semiconductor Market Trends.” Key Takeaways: ??GPUs and accelerator cards are now powering complex LLMs and large AI training datasets. ??The next wave: AI at the edge, enabling AI #smartphones, AIPC, and AI #IoT devices. ??Advanced packaging is enhancing AI performance and efficiency in GPUs, accelerators, and end devices. ??Amkor continues to lead in providing advanced packaging solutions. Learn more about our packaging solutions at https://lnkd.in/gw8Ejkh #ArtificialIntelligence #ICChina2024 #AI #Semiconductors #AdvancedPackaging #Amkor #GPU
Amkor Technology, Inc.
半导体制造业
Tempe,Arizona 69,540 位关注者
Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on.
关于我们
Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV?), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
- 网站
-
https://amkor.com
Amkor Technology, Inc.的外部链接
- 所属行业
- 半导体制造业
- 规模
- 超过 10,001 人
- 总部
- Tempe,Arizona
- 类型
- 上市公司
- 创立
- 1968
- 领域
- Semiconductors、IC Test、Wafer Bumping、MEMS & Sensors、Wafer Level Packaging、3D Packaging、TSV、Flip Chip、Package-on-Package、SiP、Chip-on-Chip、Wafer Test、IC Design、Leadframe、Laminate、WLFO、Semiconductor、CSP、BGA、Power Discretes、dsmbga、advanced packaging、wlcsp、automotive、iot、ai、computing和memory
地点
Amkor Technology, Inc.员工
动态
-
Amkor's Vinnet Pancholi, Sr. Director Test Technology explores multi-die semiconductor packaging testing challenges in his new blog post "Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification" He emphasizes the need for new standards like #UCIe that enable complex package interoperability and advanced testing methodologies. Read the full post here https://lnkd.in/gktq_F6z #Amkor #Chiplets #Chiplet #SemiconductorIndustry #ICtest #SemiconductorTest #SemiconductorManufacturing
-
Amkor Technology Korea (K5) welcomed students and faculty from Daerim and #Korea Polytechnic Universities. The comprehensive #Factory tour offered an immersive look into our 56-year history, organizational structure, and diverse job roles. Designed to provide practical #Career insights, the visit gave students a firsthand glimpse of #SemiconductorManufacturing and professional opportunities. To learn more about careers at #AmkorKorea, visit https://lnkd.in/dv6H2f5w #Amkor #Semiconductor #Semiconductor #SemiconductorIndustry #SemiconductorJobs #CollegeTour #CompanyCulture #Employment #ElectronicsManufacturing
-
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, is pleased to announce its participation in the Nasdaq 51st International Investor Conference on Tuesday, December 10, 2024. Our presentation will occur at 8:30 AM GMT (3:30 AM EST) at The May Fair Hotel in London, United Kingdom. Live webcasts and replays of our presentation will be available on the Investor Relations section of our website at https://lnkd.in/gvCnTiZ3 Our management team will also be available for one-on-one and small group meetings with investors. Stay tuned for more updates and insights from the event. We look forward to connecting with you! #AmkorTechnology #NasdaqConference #TechInnovation #AI #InvestorRelations #LondonEvents
-
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, is pleased to announce its participation in the UBS Global Technology and #AI Conference on Tuesday, December 3, 2024. Our presentation will occur at 9:35 AM MST (11:35 AM EST) at The Phoenician Resort in Scottsdale, Arizona. Live webcasts and replays of our presentation will be available on the Investor Relations section of our website at https://lnkd.in/gXqcZZqA . Our management team will also be available for one-on-one and small group meetings with investors. Stay tuned for more updates and insights from the event. We look forward to connecting with you! #AmkorTechnology #UBSConference #TechInnovation #AI #InvestorRelations #ScottsdaleEvents #ArtificialIntelligence #Investor
-
?? The Amkor Technology, Inc. Alumni Network celebrated their bi-annual reunion at DTC Sports Grille in #Tempe, #Arizona. Former colleagues shared memories and laughter while catching up over food and drinks. ?? ?? Our reunion brought together Jerry French, Leroy Christie, Ron Molnar, Moody Dreiza, Gary Hamming, Florence Gosnell, Tony Panczek, Bora Baloglu, CJ Berry, Ron Ellenberger, Doug Turnage, John McCormick, Shengmin Wen, Dave Theobauld, Bruce Bowers, Debbie Kirchhardt, Ellen Ware, Lois Rubin, Paul Mescher, Joanne Stepton, Isauro Amaro, Keith Edwards, Jody Edwards, Sharon Hosford, Nozad Karim, Akito Yoshida, Lee Smith, Jackie Porter, David McCann, Lou Nicholls, and Tim Olson Are you an #Amkor alum? Join our growing network by contacting Jackie.Porter[@]amkor.com. #AmkorTechnology #semiconductor #teammates #oldfriends #alumni #semiconductorindustry
-
+3
-
?? HOT JOB OPENINGS AT AMKOR MALAYSIA ?? Join our growing team! Amkor Technology Malaysia (ATM) has exciting opportunities for these positions: ??Engineer, Quality Control (QC) ??Engineer/Senior Engineer, Project Management (NPI) ??Officer/Senior Officer, Procurement (Planning) ??Process Engineer ??Senior Equipment Engineer (Die Attach) Your next opportunity awaits! Visit https://lnkd.in/g_2U9crC for full job descriptions and to apply. #technology #job #semiconductor #semiconductorjobs #engineeringjobs #semiconductorindustry #TeamAmkor #microelectronics #engineers #malaysiajobs #malaysia #opentowork #jobopenings #AmkorMalaysia
-
Lightmatter and Amkor Technology, Inc. Partner to Build World’s Largest 3D #Photonics Package! Lightmatter, the leader in #photonic #supercomputing, today announced a strategic partnership with?Amkor Technology, Inc.?(Nasdaq: AMKR), a leading provider of #semiconductor packaging and test services, to create the largest-ever 3D-packaged #chip complex utilizing Lightmatter’s innovative?Passage? platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to meet the unprecedented interconnect scaling and power demands of today’s #ArtificialIntelligence (#AI) workloads. Read the full press release here https://lnkd.in/grMEUGNZ #SiPh #IntegratedPhotonics #SiliconPhotonics #OpticalCommunications #PhotonicsEngineering #Amkor #Lightmatter #AdvancedPackaging
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
businesswire.com
-
Last week, Amkor's leadership team from #Singapore and #Malaysia attended ISES SEA 2024 in #Penang. Jinyoung Kim delivered a keynote presentation on "Semiconductor Packaging Technologies in the AI Era." His talk covered packaging innovations enabling #AI, #5G, and edge AI #computing. A special thank you to the ISES team for orchestrating another successful event—we appreciate all your hard work. As a long-time Platinum Sponsor of the International Semiconductor Industry Group, Amkor Technology, Inc. values our continued partnership. We look forward to seeing everyone at the ISES 2025 regional conferences. Learn more at https://isesglobal.com #Semiconductor #Semiconductors #SemiconductorIndustry #theisig #SemiconductorManufacturing #AdvancedPackaging #Chiplet #Chiplets
-
Amkor Technology Declares Increase in Quarterly Dividend and Special Dividend Amkor Technology, Inc. (Nasdaq: #AMKR), a leading provider of #semiconductor packaging and test services, announced today that its Board of Directors approved a 5% increase in the company’s quarterly cash dividend, from $0.07875 per share to $0.08269 per share, on the company’s common stock. The Board has also approved the payment of an approximately $100 million special cash #dividend, or $0.40546 per share. Both #dividends will be payable on December 23, 2024, to stockholders of record as of the close of business on December 4, 2024. “In line with Amkor’s capital allocation policy to return 40% to 50% of cumulative free cash flow generated over time, the Board of Directors has decided to declare a special cash dividend for our shareholders,” said Giel Rutten, Amkor’s president and chief executive officer. “This decision highlights our ongoing commitment to delivering value to our #shareholders and demonstrates our confidence in the long-term outlook of our business.” To learn more about investing in Amkor Technology, visit our #InvestorRelations site at https://ir.amkor.com #Amkor #AmkorTechnology #SemiconductorIndustry