As we gather to celebrate #Thanksgiving, we extend our gratitude to our dedicated employees, valued customers, and trusted partners. Your commitment drives our technological innovations and connects our world. Thank you for being an essential part of our success. Together, we continue to push the boundaries of #technology to enable a brighter #future. Share what you're thankful for this season in the comments below! #Amkor #Blessed #HappyThanksgiving #Thankful
Amkor Technology, Inc.
半导体制造业
Tempe，Arizona 69,680 位关注者
Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on.
关于我们
Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV?), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
- 网站
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https://amkor.com
Amkor Technology, Inc.的外部链接
- 所属行业
- 半导体制造业
- 规模
- 超过 10,001 人
- 总部
- Tempe，Arizona
- 类型
- 上市公司
- 创立
- 1968
- 领域
- Semiconductors、IC Test、Wafer Bumping、MEMS & Sensors、Wafer Level Packaging、3D Packaging、TSV、Flip Chip、Package-on-Package、SiP、Chip-on-Chip、Wafer Test、IC Design、Leadframe、Laminate、WLFO、Semiconductor、CSP、BGA、Power Discretes、dsmbga、advanced packaging、wlcsp、automotive、iot、ai、computing和memory
地点
Amkor Technology, Inc.员工
动态
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Exciting developments in Fan-Out Panel-Level Packaging (#FOPLP) are paving the way for #AdvancedPackaging. Amkor's Doug Scott and Eoin O'Toole share insights in Semiconductor Engineering's article, "FOPLP Gains Traction in Advanced Semiconductor Packaging," on how FOPLP is overcoming manufacturability and #Yield challenges to meet the industry's demands for higher integration densities and cost efficiency. Discover how this #Technology is evolving to support applications in #AI, #5G, and high-performance computing, read the full article at https://lnkd.in/eetAjyXg #Amkor #PLP #FanOut #PanelLevelPackaging #SemiconductorIndustry #Semiconductor
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Thank you to everyone who visited Amkor's booth at IC China 2024 and attended Eric Hsiung's presentation on “An #OSAT Perspective of the AI #Semiconductor Market Trends.” Key Takeaways: ??GPUs and accelerator cards are now powering complex LLMs and large AI training datasets. ??The next wave: AI at the edge, enabling AI #smartphones, AIPC, and AI #IoT devices. ??Advanced packaging is enhancing AI performance and efficiency in GPUs, accelerators, and end devices. ??Amkor continues to lead in providing advanced packaging solutions. Learn more about our packaging solutions at https://lnkd.in/gw8Ejkh #ArtificialIntelligence #ICChina2024 #AI #Semiconductors #AdvancedPackaging #Amkor #GPU
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Amkor's Vinnet Pancholi, Sr. Director Test Technology explores multi-die semiconductor packaging testing challenges in his new blog post "Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification" He emphasizes the need for new standards like #UCIe that enable complex package interoperability and advanced testing methodologies. Read the full post here https://lnkd.in/gktq_F6z #Amkor #Chiplets #Chiplet #SemiconductorIndustry #ICtest #SemiconductorTest #SemiconductorManufacturing
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Amkor Technology Korea (K5) welcomed students and faculty from Daerim and #Korea Polytechnic Universities. The comprehensive #Factory tour offered an immersive look into our 56-year history, organizational structure, and diverse job roles. Designed to provide practical #Career insights, the visit gave students a firsthand glimpse of #SemiconductorManufacturing and professional opportunities. To learn more about careers at #AmkorKorea, visit https://lnkd.in/dv6H2f5w #Amkor #Semiconductor #Semiconductor #SemiconductorIndustry #SemiconductorJobs #CollegeTour #CompanyCulture #Employment #ElectronicsManufacturing
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Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, is pleased to announce its participation in the Nasdaq 51st International Investor Conference on Tuesday, December 10, 2024. Our presentation will occur at 8:30 AM GMT (3:30 AM EST) at The May Fair Hotel in London, United Kingdom. Live webcasts and replays of our presentation will be available on the Investor Relations section of our website at https://lnkd.in/gvCnTiZ3 Our management team will also be available for one-on-one and small group meetings with investors. Stay tuned for more updates and insights from the event. We look forward to connecting with you! #AmkorTechnology #NasdaqConference #TechInnovation #AI #InvestorRelations #LondonEvents
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Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, is pleased to announce its participation in the UBS Global Technology and #AI Conference on Tuesday, December 3, 2024. Our presentation will occur at 9:35 AM MST (11:35 AM EST) at The Phoenician Resort in Scottsdale, Arizona. Live webcasts and replays of our presentation will be available on the Investor Relations section of our website at https://lnkd.in/gXqcZZqA . Our management team will also be available for one-on-one and small group meetings with investors. Stay tuned for more updates and insights from the event. We look forward to connecting with you! #AmkorTechnology #UBSConference #TechInnovation #AI #InvestorRelations #ScottsdaleEvents #ArtificialIntelligence #Investor
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?? The Amkor Technology, Inc. Alumni Network celebrated their bi-annual reunion at DTC Sports Grille in #Tempe, #Arizona. Former colleagues shared memories and laughter while catching up over food and drinks. ?? ?? Our reunion brought together Jerry French, Leroy Christie, Ron Molnar, Moody Dreiza, Gary Hamming, Florence Gosnell, Tony Panczek, Bora Baloglu, CJ Berry, Ron Ellenberger, Doug Turnage, John McCormick, Shengmin Wen, Dave Theobauld, Bruce Bowers, Debbie Kirchhardt, Ellen Ware, Lois Rubin, Paul Mescher, Joanne Stepton, Isauro Amaro, Keith Edwards, Jody Edwards, Sharon Hosford, Nozad Karim, Akito Yoshida, Lee Smith, Jackie Porter, David McCann, Lou Nicholls, and Tim Olson Are you an #Amkor alum? Join our growing network by contacting Jackie.Porter[@]amkor.com. #AmkorTechnology #semiconductor #teammates #oldfriends #alumni #semiconductorindustry
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?? HOT JOB OPENINGS AT AMKOR MALAYSIA ?? Join our growing team! Amkor Technology Malaysia (ATM) has exciting opportunities for these positions: ??Engineer, Quality Control (QC) ??Engineer/Senior Engineer, Project Management (NPI) ??Officer/Senior Officer, Procurement (Planning) ??Process Engineer ??Senior Equipment Engineer (Die Attach) Your next opportunity awaits! Visit https://lnkd.in/g_2U9crC for full job descriptions and to apply. #technology #job #semiconductor #semiconductorjobs #engineeringjobs #semiconductorindustry #TeamAmkor #microelectronics #engineers #malaysiajobs #malaysia #opentowork #jobopenings #AmkorMalaysia
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Lightmatter and Amkor Technology, Inc. Partner to Build World’s Largest 3D #Photonics Package! Lightmatter, the leader in #photonic #supercomputing, today announced a strategic partnership with?Amkor Technology, Inc.?(Nasdaq: AMKR), a leading provider of #semiconductor packaging and test services, to create the largest-ever 3D-packaged #chip complex utilizing Lightmatter’s innovative?Passage? platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to meet the unprecedented interconnect scaling and power demands of today’s #ArtificialIntelligence (#AI) workloads. Read the full press release here https://lnkd.in/grMEUGNZ #SiPh #IntegratedPhotonics #SiliconPhotonics #OpticalCommunications #PhotonicsEngineering #Amkor #Lightmatter #AdvancedPackaging
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
businesswire.com