DoD ManTech invests in American manufacturing research and development to equip our warfighters with the most cutting-edge capabilities available. We need to be ahead of our adversaries in every aspect of defense operations, with the ability to rapidly innovate to fit the requirements of our warfighters wherever their mission takes them.? ?“Advanced manufacturing not only guarantees our Nation’s security by better preparing our warfighters, it ensures U.S. economic growth with a vibrant, technology-driven industrial base and the highly-skilled, well-paid workforce that goes along with it.” - Keith DeVries, DoD ManTech Director.
AIM Photonics
半导体制造业
Albany，NY 6,871 位关注者
Accelerating the transition of America's integrated photonics solutions from innovation to manufacturing
关于我们
The American Institute for Manufacturing Integrated Photonics (AIM Photonics), is an industry driven public-private partnership that focuses the nation’s premiere capabilities and expertise to capture critical global manufacturing leadership in a technology that is both essential to national security and positioned to provide a compelling return-on-investment to the U.S. economy. The Institute’s goal is to emulate the dramatic successes experienced by the electronics industry over the past 40 years and transition key lessons, processes, and approaches to the photonic integrated circuit (PIC) industry. AIM Photonics supports small and medium enterprises, providing practical access and technology on-ramps for U.S. industry, government, and academic communities. We are creating a national PIC manufacturing infrastructure, widely accessible and inherently flexible to meet the challenges of the marketplace with practical, innovative solutions. VISION: Establish a technology, business and education framework for industry, government and academia to accelerate the transition of integrated photonic solutions from innovation to manufacturing-ready deployment in systems spanning commercial and defense applications. MISSION: Seek to advance integrated photonic circuit manufacturing technology development while simultaneously providing access to state-of-the-art fabrication, packaging, and testing capabilities for small-to-medium enterprises, academia and the government; create an adaptive integrated photonic circuit workforce capable of meeting industry needs and thus further increasing domestic competitiveness; and meet participating commercial, defense and civilian agency needs in this burgeoning technology area.
- 网站
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https://www.aimphotonics.com/
AIM Photonics的外部链接
- 所属行业
- 半导体制造业
- 规模
- 201-500 人
- 总部
- Albany，NY
- 类型
- 非营利机构
- 创立
- 2015
- 领域
- Integrated Photonics、Test, Assembly, and Packaging、Photonic Integrated Circuits、Process Design Kit、Multi Project Wafers、Education and Workforce Development和Electronic Photonic Design Automation
地点
AIM Photonics员工
动态
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It's going to be great to see our friends and collaborators Aeon Williams and Kevin McComber at OFC next week! We can't wait to catch up and learn what's new at Spark Photonics and Luceda Photonics. #networking #thefutureisphotonics
?? See You at #OFC2025 in San Francisco! ?? Join us April 1-3 at the Moscone Center as we celebrate OFC50—marking 50 years of breakthroughs in #OpticalNetworking and #Communications! ?? ?? Find us at Booth #6056 to connect with the teams from Spark Photonics and Luceda Photonics and dive into the latest in #IntegratedPhotonics, #Design, #Software, and #Services. ?? Who You'll Meet: ?? Spark Photonics: Aeon Williams, Christian Bottenfield, Cooper Hurley, Eliezer Shahid, Kevin McComber, Sean Nelan ??Luceda Photonics: Chiara Alessandri, Craig Godbold, Grigorij Muliuk, Matthew Delaney, Pieter Dumon Looking forward to seeing you in San Francisco and discussing the future of #Photonics! ?? #OFC2025 #LucedaIPKISS #Innovation #Optics #Conferences
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Join AIM Photonics at the University at Albany for STEM and Earth Sciences Family Day on Sunday, March 30th at 9:30am in the ETEC Building on the east Harriman Campus for a fun and interactive day for young learners interested in science, technology, engineering, and mathematics! #thefutureisphotonics #STEMforthewin #STEMlearning
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Join AIM Photonics at #OFC2025 in San Francisco, March 30–April 3! Don’t miss our show floor program on April 2, covering the latest in silicon photonics—quantum dot lasers, prototype development, and advanced packaging. Stop by booth #6049 to connect with industry leaders and explore some of our members' innovative solutions. #IntegratedPhotonics #AdvancedManufacturing
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Today, on National Science Appreciation Day, we celebrate the power of scientific discovery and innovation! We are proud to support the scientists, engineers, researchers, and innovators shaping the future at NY CREATES. We recognize science fuels our advancements in semiconductor R&D, and workforce development initiatives, as we continue to drive technology forward together. #NYCREATES #NationalScienceAppreciationDay #Innovation #Semiconductors
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Interesting work coming out in the field of quantum electronics for silicon photonics.
A recent publication in the IEEE Journal of Selected Topics in Quantum Electronics explores advancements in silicon photonics for AI/ML accelerators. Researchers have developed a scalable III-V-on-silicon photonic platform that integrates lasers, optical amplifiers, and other essential components on the same wafer. This technology aims to address the limitations of traditional von Neumann architectures, enabling high-density, low-loss photonic integrated circuits (PICs) for more efficient neural network operations. https://lnkd.in/gp67m4Uf #AI #MachineLearning #SiliconPhotonics #EnergyEfficiency #QuantumElectronics #Optoelectronics Citation: Figure 2 from IEEE Journal of Selected Topics in Quantum Electronics (Volume: 31, Issue: 3: AI/ML Integrated Opto-electronics, May-June 2025).
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Shout out to Capri O'Hara who is part of our AIM Photonics Education Workforce Development team and a driving force behind promoting STEM education, and our partners at the Spark Photonics Foundation. #thefutureisphotonics #educationworkforcedevelopment
?? Shaping the Future of STEM: Capri O’Hara ?? Capri O’Hara is an educator and lifelong learner dedicated to creating pathways for students to explore STEM. As an Educational Outreach and Workforce Development Manager, she believes STEM is not just about specific careers—it’s about fostering critical thinking, problem-solving, and curiosity that apply across all fields. Her passion for inclusive education was solidified when she developed hands-on, accessible STEM lessons for a visually impaired student. By designing tactile models, 3D-printed components, and audio descriptions, Capri experienced firsthand how STEM can be adapted to engage every learner, reinforcing her belief that STEM skills are life skills—valuable in any profession, from technology and healthcare to business and the arts. Through her work, Capri is committed to ensuring that all students—regardless of background or ability—can see themselves in STEM. By designing hands-on programs, promoting mentorship, and showcasing diverse role models, she empowers students to take ownership of their learning and explore the many ways STEM can shape their futures. #STEMEducation #FutureInnovators #RepresentationInSTEM NY CREATES
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Technical Director - NORDTECH @ NYCREATES | Adjunct Professor - University at Albany | INTJ
Congrats to the team pulling off this complicated build! PICs from AIM Photonics , EICs from TSMC , and some post-fab magic!
Researchers from Columbia University and Cornell University recently reported a 3D-photonic transceiver that features 80 channels on a single chip and consumes only 120fJ/bit from its electro-optic front ends. The #transceiver achieves low energy consumption through low-capacitance 3D connections between photonics and co-designed #CMOS electronics. Each channel has a relatively low data rate of 10Gbps, allowing the transceiver's electronics to operate with high sensitivity and minimal energy consumption. The large array of channels compensates for the low per-channel data rates, delivering a high aggregate data rate of 800Gbps in a compact transceiver area of only 0.15mm2?(@5.3Tbps/mm2). In addition, having many low-data-rate channels relaxes signal processing and time multiplexing of data streams native to the processor. Furthermore, wavelength-division-multiplexing (#WDM) sources for numerous data streams are becoming available with the advent of chip-scale microcombs. The EIC is bonded to the PIC based on a 15μm spacing and a 10μm bump diameter (@25μm pitch) in an array of 2,304 bonds. This process mitigates two potential failure risks: 1) excessive tin causing flow and electrical short to adjacent bonds and 2) insufficient tin leading to brittle bonds. ??Figure 1: a) An illustration of the 3D-integrated photonic-electronic system combining arrays of electronic cells with arrays of photonic devices.?b) A microscope image of the 80-channel photonic device arrays with an inset of two transmitter and two receiver cells.?c) Microscope images of the photonic and electronic chips. The active photonic circuits occupy an area outlined in white, while the outer photonic chip area is used to fan out the optical/electrical lanes for fiber coupling and wire bonding. The blue overlay shows a four-channel transmitter and receiver #waveguide path; the disk and ring overlays are not to scale. An inset shows a diagram of the fiber-to-chip edge coupler, consisting of a silicon nitride (Si3N4) inverse taper and escalator to silicon.?d) A scanning electron microscope image of the bonded electronic and photonic chip cross-section.?e) An image of the wire-bonded transceiver die bonded to a printed circuit board and optically coupled to a fiber array with a US dime for scale.?f) A cross-sectional diagram of the electronic and photonic chips and their associated material stacks. Both chips consist of a crystalline silicon substrate, doped-silicon devices and metal interconnection layers. Daudlin, S. et al.?Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links.?Nat. Photon.?(2025).??https://lnkd.in/gpeVGZna #SemiconductorIndustry #Semiconductor #Semiconductors #AI #HPC #Datacenter #Optics #Photonics #SiliconPhotonics #Optical #Networking #OCI #Ethernet #Infrastructure #Interconnect #CloudAI #AICluster AIM Photonics TSMC Defense Advanced Research Projects Agency (DARPA) #FiberCoupling #SiP
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With NVIDIA's recent announcement that their next-generation switches will include co-packaged optics based on silicon photonics, it's clear that this technology will play a central role in scaling future AI systems. However, it's still unclear how far we can push the performance of silicon photonic interconnects to accommodate the endless demand for larger models. In our recent work, published today in Nature Photonics, we demonstrate a complete 3D-integrated electronic-photonic link with an unprecedented 5.3 Tb/s/mm2 bandwidth density and 120 fJ/bit energy consumption. This system heterogeneously integrates a silicon photonic chip fabricated through AIM Photonics and a co-designed CMOS electronic chip fabricated through TSMC with 2,304 copper pillar microbump connections between them in an area of just 0.3 mm2. We believe that this demonstration begins to approach the ultimate density and energy efficiency limits of practical planar silicon photonic links, providing a clear roadmap for continued future scaling of AI computing systems with enhanced performance and reduced energy consumption.? For those who are interested in the technical details, we encourage you to check out the paper and/or the Columbia Engineering news article, both linked below. Link to paper: https://lnkd.in/esbYptUA Link to Columbia Engineering article: https://lnkd.in/eStjZzRu
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Our PIC Test and Packaging Workshop is a great way to learn about testing, analysis, and packaging. Shout out to our collaborators who make this course one of our most sought after, hand-on learning experiences. Learn more about our EWD courses: https://lnkd.in/gKChAhYk #thefutureisphotonics #educationworkforcedevelopment
03/13-14/2025 Our group taught an important part of this year’s AIM Photonics PIC Testing and Packaging Workshop at UofR, RIT and the AIM TAP Facility. Attendees learn testing, analysis, and packing of photonic integrated circuits. AIM Photonics The Institute Of Optics #RIT
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