AGC Multi Material America, Inc.

Meteorwave M1 exhibits stable dielectric performance and very high reliability over temperature and time. (https://lnkd.in/gAxGfx7H) Visit us at IPC Expo, Booth #3814 or contact your local sales and technical service representative to schedule a presentation.

Enjoy iconnect007's Interview with AGC's Paul Cooke. https://lnkd.in/gf6_r4QB?

AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025. Pau lCooke of AGC is presenting a professional development course “PD10: PCB design for High Reliability” on Sunday Mar. 16, 2025 at 1:30pm. Additionally, Kevin Bivona of AGC is presenting "Investigating Hole-Wall to Hole-Wall Filament Growth Induced by PCB Design Features” on Wednesday, Mar. 19, 2025 at 3:30pm. Visit us at Booth 3814 to learn more about AGC Multi Material’s comprehensive material offering. We offer an entire range of substrate materials for the electronics industry including digital, RF and hybrid solutions. Ask about fastRise build-up materials, N7000-3F toughened polyimide, Meteorwave low loss substrates and ELL, our newest, extremely low loss laminate and prepreg series. Learn more at our website https://lnkd.in/gnCfFbUU. IPC APEX EXPO ?is the industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference and professional development courses. We are looking forward to meeting you!

Kevin Bivona of AGC Multi Material America is presenting at the upcoming #ipcapexexpo IPC Apex Expo on Wednesday, 3/19 at 3:30pm in room 303-C. Stop by to learn more about the causes of CAF failures the importance of CAF resistant materials.

AGC Multi Material is highlighting new products at iMAPS Device Packaging Conference ? AGC Multi Material America (AMMA) is participating in the iMAPS Device Packaging conference in Phoenix, AZ on March 3-6, 2025. ? Visit us at the AGC booth 209 to learn more about AGC Multi Material’s newest material offerings including fastRise TC and fastRise HF, non-reinforced build-up films for indestructible stacked microvias. Learn more at our website agc-multimaterial.com. ? The?21st Annual Device Packaging Conference (DPC 2025), organized by the International Microelectronics Assembly and Packaging Society, is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. (https://lnkd.in/gQi9x5sd) ? We are looking forward to meeting you!

Paul Cooke, director of application engineering at AGC Multi Material America, Inc., will discuss how #PCBdesign affects fabrication?at PCB East. It's the #electronics industry's #eastcoast conference and exhibition for #PCBdesign, #PCBfabrication, and #PCBassembly in the #greaterboston area!?? ? #surfacefinish #soldermask #PCBdesigner #PCBfabricator #assemblyengineer #copperweights #designengineers #systemdesigners #PCBfabricators # ? Brought to you by PCEA-Printed Circuit Engineering Association.

If you missed Paul at SMTA UHDI or DesignCon, Paul will be teaching at pcbeast.com and www.ipcapexexpo.org this spring. SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions :: I-Connect007 (iconnect007.com)

AGC is excited to have our materials included in Happy’s Tech Talk #37. Ultra High Density Interconnect technologies are an important PCB trend. AGC’s fastRise TC and fastRise HF are non-reinforced material with extremely low X, Y, Z thermal expansion. fastRise HF is a halogen free version currently being evaluated by key customers. Learn more about fastRise TC on our website (https://lnkd.in/gBkft5Hv) or ask us for more information on fastRise HF. ? https://lnkd.in/g_pQSUcT

Paul Cooke’s session at the SMTA Ultra HDI Meeting was well attended. Thank you for your support! If you'd like more information on PCB Materials for Ultra HDI, let us know.

Great information from AGC's Paul Cooke.