ACM RESEARCH, INC.

Introducing our next employee spotlight, Stephen Hensley! Our talented Engineer in Charge based in Hillsboro, Oregon, brings with him expertise in engineering and leadership that has fostered a dynamic work environment within our team. Thank you, Stephen, for your dedication and strong work ethic! Scroll to learn more about Stephen and check out our careers page for more information about our open job positions: https://lnkd.in/gm7rUcWr #ACMResearch #EmployeeSpotlight

It’s great to be at this year’s #SEMICONEuropa to see what is at the forefront of innovation, with exciting things on the horizon for the semiconductor industry! Our team had a wonderful time kicking off the week at 3D InCites’ Stammtisch event for the second consecutive year, catching up with colleagues and friends. Visit us at booth C2265 to discuss how we can meet your manufacturing equipment needs, or send us a message at [email protected]! SEMI Europe #Semiconductor #ACMResearch

Get to know the ACM Research team! Our Senior Field Service Engineer, Tommy Khon, joined us in 2023, enriching our team with his experience and work ethic. Tommy enjoys working in a dynamic and multicultural environment where everyone brings different expertise to the table to solve real-time solutions. He appreciates how everyone’s opinion is valued within a great work culture. In his free time outside of work, Tommy enjoys motorsports, listening to music, and enjoying various kinds of food. Tommy’s advice to those looking for a career in the semiconductor industry would be to encourage them to explore their curiosity. Interested in joining our team? Apply here: https://lnkd.in/g4Yp5zfE #EmployeeSpotlight #Careers #ACMResearch

Excellent work team!

We implemented major upgrades to our flagship Ultra C Tahoe cleaning tool to meet the emerging requirements of front-end semiconductor manufacturing at or below 28nm node for foundry, logic and memory applications. Our upgraded tool offers enhanced cleaning performance, higher throughput, more process flexibility, and up to 75% reduction in chemical consumption. Our President and CEO David Wang commented: “With the rise of AI to the forefront of consumers’ minds, we expect increased public attention on the environmental impact of semiconductor chip manufacturing. We believe ACM’s Ultra C Tahoe is well-positioned to help customers increase production of advanced AI chips, but with a reduced footprint on the environment. We believe the Ultra C Tahoe is another example of excellence from ACM’s innovative and world-class R&D team." Read the full press release: https://lnkd.in/ebgwZQXa #ACMResearch #UltraCTahoe #AdvancedPackaging #AI #Sustainability

We implemented major upgrades to our flagship Ultra C Tahoe cleaning tool to meet the emerging requirements of front-end semiconductor manufacturing at or below 28nm node for foundry, logic and memory applications. Our upgraded tool offers enhanced cleaning performance, higher throughput, more process flexibility, and up to 75% reduction in chemical consumption. Our President and CEO David Wang commented: “With the rise of AI to the forefront of consumers’ minds, we expect increased public attention on the environmental impact of semiconductor chip manufacturing. We believe ACM’s Ultra C Tahoe is well-positioned to help customers increase production of advanced AI chips, but with a reduced footprint on the environment. We believe the Ultra C Tahoe is another example of excellence from ACM’s innovative and world-class R&D team." Read the full press release: https://lnkd.in/ebgwZQXa #ACMResearch #UltraCTahoe #AdvancedPackaging #AI #Sustainability

As we enter the last quarter of 2024, we would like to share our Q3 2024 financial results: https://lnkd.in/exra5Etm For further insights, we invite you to visit our IR webpage to download the presentation: https://ir.acmr.com/

With the growing need for stacking logic and memory, 3D NAND, and DRAM in HBMs, chipmakers rely on vertical stacking processes like die-to-wafer hybrid bonding to keep manufacturing processes robust. But, the transition to vertical highlights a pressing challenge many chipmakers face: finding ways to reduce wafer-edge defects. Our Chief Technologist Sally Ann Henry weighs in on the capabilities of bevel etching cleaning processes for high-volume production in a recent Semiconductor Engineering article. “People have been trying to clean edge defects and the bevel for 20 years. Obviously, as we’ve moved down in technology nodes, it’s become more of an issue because people want to get more good die from the edge of the wafer. We have an edge exclusion of 2mm currently, and customers would prefer 1mm, so the defects on the edge of the wafer become more and more important.” Read the full article for more details about these techniques and what is on the precipice for advanced packaging: https://lnkd.in/gVsxzkse #ACMResearch #Semiconductor #AdvancedPackaging

SEMICON Europa is right around the corner! Find us at booth #C2265 to explore solutions for wafer-level packaging. Connect with our team of experts in Germany and book a meeting with us at [email protected]. #SEMICONEuropa SEMI Europe #WaferLevelPackaging #Semiconductor

We’re delighted to announce the completion of our new 1-million-square-foot production facility in Shanghai! After four years of construction, this long-awaited facility will triple our manufacturing capacity, allowing us to greater serve our customers with compound semiconductor manufacturing and wafer-level packaging needs. We were honored to celebrate the grand opening with our global partners and key stakeholders. This new facility is a testament to our continuous growth, expansion, and innovation within the industry and we look forward to what comes next for the future of ACM Research! #ACMResearch #ShanghaiFacility #GrandOpening