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What is the difference between in-circuit testing and functional testing for semiconductor devices?

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If you work with semiconductor devices, you know that testing and quality control are essential steps in the production process. But do you know the difference between in-circuit testing and functional testing, and when to use each one? In this article, we will explain the basics of these two methods, their advantages and disadvantages, and some tips on how to choose the best one for your project.

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Dat Le

Tech Expert - AF Aircraft Avionics

1 In-circuit testing

In-circuit testing (ICT) is a method of testing individual components or circuits on a printed circuit board (PCB) before they are assembled into a final product. ICT uses a special device called a bed of nails, which consists of a board with hundreds of probes that connect to specific points on the PCB. By applying electrical signals and measuring the responses, ICT can detect faults such as shorts, opens, wrong values, or incorrect orientations of components. ICT is fast, accurate, and reliable, but it also requires a custom-designed bed of nails for each PCB design, which can be costly and time-consuming.

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Dat Le

Tech Expert - AF Aircraft Avionics
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In the Automatic Test world, ICT is also known as Shop Replaceable Unit or SRU testing. At this level, inputs are applied directly to the circuit card via software controlled stimuli and outputs are captured by measurement instrumentation. These inputs could be analog or digital. Via the software controlled process, faulty circuits are identified and components are further isolated via diagnostic subroutines. Most of this happens without human intervention and if the software programmer was skilled at coding, the ambiguity group could be narrowed down to 5% or less. The ultimate goal is to obtain 100% fault detection for all tests.

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Phil Schoenthal

With Winanas / Scioto Services / Marsden Company, for janitorial duties.
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I consider In-Circuit Testing as another means of HOT Testing. I have never liked doing that, unless deemed really neccessary, since trying to test and apply power to something In-Circuit could damage something else. That said, if I do not have various test-points, I will use a leg of a transistor, or IC pin, and a resistor leg, to clamp a 'scope probe to, take AC / DC voltage measurements and look at waveforms. If, I suspect a component is leaky, especially capacitors, I will take the extra measure to desolder a component out of circuit and test externally. That way, I can measure the OEM spec's of a component safely and not be fooled by loading-down in an expensive circuit in a piece of gear.

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Presanna Govindaraj
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In-circuit testing and functional testing are two distinct approaches to assessing semiconductor devices. In-circuit testing involves checking individual components and connections on the board, verifying their electrical characteristics and ensuring proper assembly. It is particularly effective for identifying manufacturing defects. On the other hand, functional testing evaluates the overall functionality of the semiconductor device by subjecting it to real-world operating conditions. This method validates the device's performance according to its intended purpose, uncovering potential issues that might not be apparent during in-circuit testing.

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2 Functional testing

Functional testing (FT) is a method of testing the functionality and performance of a finished product that contains one or more semiconductor devices. FT uses a test fixture that simulates the real-world environment and conditions that the product will operate in, such as temperature, voltage, frequency, load, and input/output signals. By comparing the actual output with the expected output, FT can verify that the product meets the specifications and requirements of the customer. FT is flexible, adaptable, and comprehensive, but it also depends on the quality of the test fixture and the test software, which can be complex and prone to errors.

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3 Pros and cons of ICT and FT

Choosing between ICT and FT for semiconductor device and product testing depends on the type, size, complexity, and purpose of the device. Cost, speed, coverage, and complexity are factors that can influence the decision. ICT is more expensive upfront but can save money in the long run; it is faster but has less coverage. On the other hand, FT is cheaper upfront but can incur more costs in the long run; it is slower but has more coverage. Additionally, ICT requires a bed of nails and a tester for electrical signals while FT requires a test fixture to simulate real-world conditions and a test software to generate and analyze input/output signals. Ultimately, both methods have their pros and cons depending on the application.

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Josué De La Rosa

Maintenance Engineer/Controls specialist
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Es importante resaltar la diferencia, una prueba funcional se establece para validar que un componente electrónico sea capaz de llevar a cabo la función para la cual ha sido fabricado y se debe llevar a cabo con conocimiento de las especificaciones del fabricante. Por otra parte, una prueba en circuito, nos sirve para saber si el componente (el cual, sabemos lleva a cabo su función primaria) es capaz de realizar la función que se le requiere en el circuito, para esto es importante contar con el diagrama del mismo y conocer plenamente su función

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4 How to choose the best testing method

There is no definitive answer to which testing method is better, as it depends on the project's specific characteristics and objectives. Nevertheless, some general guidelines can help you decide. For instance, if you have a large number of PCBs with the same design, use ICT to ensure the quality and consistency; also, it can help debug and optimize the PCB design before moving to assembly. If you have a small number of products with different designs, FT is a better choice; it can validate and verify the product design before delivery to the customer. If you want to reach the highest level of testing and quality control and have the budget and time to do so, combining ICT and FT will allow you to benefit from both methods while minimizing their risks.

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5 Tips for effective testing

When testing semiconductor devices and products, it is important to plan ahead and define your testing goals, specifications, and requirements. Doing so will help you select the right testing method, tools, and resources. Additionally, testing should be done early and often throughout the development cycle in order to detect and fix any faults as soon as possible. Lastly, documenting and reporting your testing results, procedures, and issues is essential in order to track progress, performance, and quality. It also helps with effective communication with team members, stakeholders, and customers.

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6 Here’s what else to consider

This is a space to share examples, stories, or insights that don’t fit into any of the previous sections. What else would you like to add?

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What is the difference between in-circuit testing and functional testing for semiconductor devices?

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3

4

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1 In-circuit testing

2 Functional testing

3 Pros and cons of ICT and FT

4 How to choose the best testing method

5 Tips for effective testing

6 Here’s what else to consider

Electronic Engineering

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What is the difference between in-circuit testing and functional testing for semiconductor devices?

1

2

3

4

5

6

1 In-circuit testing

2 Functional testing

3 Pros and cons of ICT and FT

4 How to choose the best testing method

5 Tips for effective testing

6 Here’s what else to consider

Electronic Engineering

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