What is the best way to optimize the return path for high-speed signals in a PCB?

Reference Plane must be: Ensure a solid reference plane.This minimizes loop inductance and reduces signal return path impedance. Short, Direct Paths: Keep the return path as short and direct as possible.

Reference Plane: Ensure a solid reference plane beneath the signal trace, typically a ground plane. This minimizes loop inductance and reduces signal return path impedance. Short, Direct Paths: Keep the return path as short and direct as possible. Minimize loops and avoid sharp bends, which can introduce additional inductance. Parallelism: Maintain parallelism between the signal trace and its return path. This helps to reduce loop inductance and mutual inductance.

The best option to optimise the return path for any High speed signals is to ensure that there is a solid ground layer underneath the signal layer. Add GND vias at the transition of these signals from one layer to another signal layer ensuring that there is no impedance discontinuity. However the pattern of placing these GND vias will be suggested by the signal Integrity team. In case due to layer unavailability there is a possibility of your signal crossing the plane splits then ensure to have a stitching capacitor. Also have the 20H rule to reduce the EMI .

Inner layer routing with a ground plane above and below, known as stripline, is best for long runs whether it is a single-ended or differential pair. You could add a guard band on the routing layer to complete the faraday cage. For shorter runs, assuming you have surface mount components, the microstrip method is preferred. That's because the via presents a discontinuity that hits harder than the radiation of the exposed trace. In any case, it pays to add ground stitching vias along the length of the transmission lines. The spacing of the vias will be a function of the frequency (RF) or the rise times (digital) of the circuit. Ideally, there would also be a ring of ground vias around the entire perimeter of the board.

Making a trace short does not "optimize" a return path (whatever "optimize" is supposed to mean)... As long as we're not in audio frequencies and we're routing over a plane, the return path will follow the signal path. Thousands of simulations in the literature and industry publications show this. Your job is to select a transmission line geometry that meets your design goals and route it properly, you only have control over a return path in so much as it is based on where you place ground. When selecting a transmission line geometry, no one asks "where will the return path be for this line?" We already know Also: a solid plane beneath a trace does not create a coplanar waveguide, and a ground trace does not create a microstrip line.

The best way to optimize the return path for high-speed signals is to ensure it follows the signal path for entire length. For microstrip there is a GND plane under the surface trace. For stripline, there is a reference plane above and below the signal trace(s). Ideally GND reference plane(s) on adjacent layer(s) is preferred but PWR planes can be used in some cases. To minimize loop inductance reference plane(s) should be continuous ensuring the trace(s) do not cross any splits. A GNDed coplanar waveguide includes a solid GND plane under the signal trace with GND traces coplanar to the signal trace. The coplanar GND traces should have via stitching spaced at ~1/10th lambda of the highest frequency signal content for the entire length.

You could add a guard band on the routing layer to complete the faraday cage.The best option to optimise the return path for any High speed signals is to ensure that there is a solid ground layer underneath the signal layer.In any case, it pays to add ground stitching vias along the length of the transmission lines. The spacing of the vias will be a function of the frequency (RF) or the rise times (digital) of the circuit. Ideally, there would also be a ring of ground vias around the entire perimeter of the board.

You don't want to cross over a gap between two planes due to the electromagnetic interference. If you can find another layer or revise the planes and traces, that would be better. If you are hemmed in and cannot avoid having the transmission line crossing over from one plane to another, it can be mitigated by placing one or more decoupling capacitors across the gap. That is still an open circuit at DC but will pass the return current along with minimal disruption.

To get a better result, try using a capacitor between the two parts, this way the noise will be reduced. if you want to be good designer every month define one campaign and solve it

Avoid power plane as reference. Most of the time reference split happen when we choose power plane as reference. for high speed signal always choose both side solid gnd as reference.

This requires an electromagnetic simulation, ideally in 3D but probably also can be done in 2D in a cross-sectional view. You will never measure this directly on a test board or with a network analyzer so there is no point in this being included in the AI generated answer. Any inference of the return path from these measurements involves extraction of an interconnect's circuit parameters from its simulated or measured S-parameters, followed by a comparison between the extracted circuit values and the design values. This tells you whether the there is significant deviation between your intended design and the actual test board/test circuit.

Before designing, prepare specific instructions for your work This instruction is based on IPC standards After finishing the design, you can check your board with saturn software, but it is better to check your board in three stages. The first step is to use the ipc checklist The second step by Altium Designer software tools The third stage of using artificial intelligence

Using 3D field solver, the return current distribution for the highspeed signal can be analyzed. But it consume more time to simulate over the large frequency band. Even it consume days to provide the simulation results.

The best way to improve your skills is to avoid PCB design guidelines that were generated by AI. Hopefully the LinkedIn gods will continue syndicating this and we can all have a good laugh.

Provide a solid ground reference plane for high speed signals. Add the ground return via close to the signal transition between each layer.

While building up stack up, ensure the GND planning for all the high speed signals in order to ensure the solid GND reference through out the PCB.

As I said in the book Successful Electronics Engineer, one of the 5 characteristics of a successful electronics engineer is continuous education. It is better to define a challenge for yourself a week and learn that challenge by paying attention to the contents of reputable educational sites or participating in good training courses.