Cooling a processor is not a simple task, as it involves several challenges. Thermal design must balance performance, power, temperature goals, and physical constraints. Thermal management must optimize cooling efficiency and performance, as well as noise and power consumption. Thermal monitoring must provide accurate and timely feedback and adjustment, while preventing overheating and damage. It involves the design of the processor and its components, such as the die, the package, the heat sink, and the thermal interface material. It also involves the management of the processor and its cooling system, such as the fan speed, the pump speed, the voltage, and the frequency. Finally, it includes monitoring of the processor and its cooling system, such as temperature sensors, fan controllers, software tools, and indicators.